Irving Memis | Researchain

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Featured researches published by Irving Memis.

Archive | 1998

Attaching heat sinks directly to flip chips and ceramic chip carriers

William E. Bernier; Michael A. Gaynes; Irving Memis; Hussain Shaukatuallah

Archive | 2001

Full additive process with filled plated through holes

Anilkumar Chinuprasad Bhatt; Voya R. Markovich; Irving Memis; William E. Wilson

Archive | 1990

Electrical and/or thermal interconnections and methods for obtaining such

Lawrence C. Alexander; Bernd K. Appelt; David K. Balkin; James Jens Hansen; Joseph Hromek; Ronald Anthony Kaschak; John M. Lauffer; Irving Memis; Magan S. Patel; Andrew M. Seman; Robin A. Susko

Archive | 1979

Sealing of integrated circuit modules

Russell Elwood Darrow; Irving Memis; Richard M. Poliak

Archive | 2000

Circuit board with primary and secondary through holes

Irving Memis

Archive | 2005

High wireability microvia substrate

Irving Memis

Archive | 1993

Method of making an electronic package assembly with protective encapsulant material

Barry Alan Bonitz; James Vernon Ellerson; Kishen Narain Kapur; Jack Marlyn Mccreary; Irving Memis; Gerald Michael Vettel

Archive | 1995

Method for improving the adhesion of polymeric adhesives to nickel surfaces

Steven F. Arndt; Irving Memis; James Spalik; Tien Y. Wu

Archive | 1975

Hermetic topsealant coating and process for its formation

Peter Bakos; Irving Memis; John Rasile

Archive | 2005

Extension of fatigue life for C4 solder ball to chip connection

William E. Bernier; Charles F. Carey; Eberhard B. Gramatzki; Thomas R. Homa; Eric A. Johnson; Pierre M. Langevin; Irving Memis; Son K. Tran; Robert F. White

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