Jack E. Hetzner

Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

The adhesion of several commercial underfills (Dexter Hysol FP4511, FP4527, and CNB775-34) to BCB (CYCLOTENE 4022, 4024) has been studied through die shear testing and subsequent failure analysis. Die shear values range between 69-30 MPa. Failure analysis by optical microscopy, profilometry and XPS spectroscopy indicates mixed mode failure at various interfaces. From the die shear data collected before and after 24 h water boil for Cyclotene 4022 and 4024 (with AP3000 adhesion promoter) and underfillers FP 4511 and 4527 we find the die shear strength decreases an average of 11% for the four comparisons. Adhesion promoters based on vinyltriacetoxysilane or 3-amino-propyltriethoxysilane show equivalent die shear performance. Substrate surface cleaning based on UV ozone treatment reveals oxidation of the BCB surface which by SIMS analysis remains <0.1 /spl mu/m deep after 10 min of treatment.

A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

This work describes a positive-tone and aqueous-base-developable benzocyclobutene (BCB)-based dielectric material. The polymer is made from divinylsiloxane bis(benzocyclobutene) and BCB-acrylic acid. A diazonap-thoquinone in the formulation makes it photosensitive. Patterned films have high resolution, and via openings are scum-free without a de-scum operation. The material possesses optical, electrical, thermal, and mechanical properties desirable for many microelectronic applications, including as a planarization layer or an insulation layer in display, and in packaging.

Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in Air

A positive-tone and aqueous-base-developable benzocyclobutene (BCB)-based dielectric material curable in air is described in this paper. The prepolymer is made from divinylsiloxane bisbenzocyclobutene (DVS-bisBCB) and BCB-acrylic acid. The formulation contains antioxidants that allow the prepolymer to cure in air and a diazonaphthaquinone to make it photosensitive. Patterned films have high resolution, and via openings are scum-free without a descum operation. Whether cured in nitrogen or in air, the prepolymer produces a film with optical, electrical, thermal, and mechanical properties desirable for many microelectronic applications, such as packaging applications and as a planarization or insulation layer in display applications

P-59: Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material for Display Applications

A self-priming and photosensitive aqueous-base-developable benzocyclobutene (BCB)-based dielectric material curable in air is described. Patterned films have high resolution. Whether cured in nitrogen or in air, the formulation produces a film with optical, electrical, thermal, and mechanical properties desirable for many microelectronic applications, such as a planarization layer or insulation layer in display applications.