Jaime Zahorian

Single-chip CMUT-on-CMOS front-end system for real-time volumetric IVUS and ICE imaging

Intravascular ultrasound (IVUS) and intracardiac echography (ICE) catheters with real-time volumetric ultrasound imaging capability can provide unique benefits to many interventional procedures used in the diagnosis and treatment of coronary and structural heart diseases. Integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with front-end electronics in single-chip configuration allows for implementation of such catheter probes with reduced interconnect complexity, miniaturization, and high mechanical flexibility. We implemented a single-chip forward-looking (FL) ultrasound imaging system by fabricating a 1.4-mm-diameter dual-ring CMUT array using CMUT-on-CMOS technology on a front-end IC implemented in 0.35-μm CMOS process. The dual-ring array has 56 transmit elements and 48 receive elements on two separate concentric annular rings. The IC incorporates a 25-V pulser for each transmitter and a low-noise capacitive transimpedance amplifier (TIA) for each receiver, along with digital control and smart power management. The final shape of the silicon chip is a 1.5-mm-diameter donut with a 430-μm center hole for a guide wire. The overall front-end system requires only 13 external connections and provides 4 parallel RF outputs while consuming an average power of 20 mW. We measured RF A-scans from the integrated single- chip array which show full functionality at 20.1 MHz with 43% fractional bandwidth. We also tested and demonstrated the image quality of the system on a wire phantom and an ex vivo chicken heart sample. The measured axial and lateral point resolutions are 92 μm and 251 μm, respectively. We successfully acquired volumetric imaging data from the ex vivo chicken heart at 60 frames per second without any signal averaging. These demonstrative results indicate that single-chip CMUT-on-CMOS systems have the potential to produce realtime volumetric images with image quality and speed suitable for catheter-based clinical applications.

Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications

One of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Ex- periments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.

Dual-electrode CMUT with non-uniform membranes for high electromechanical coupling coefficient and high bandwidth operation

In this paper, we report measurement results on dual-electrode CMUT demonstrating electromechanical coupling coefficient (k2) of 0.82 at 90% of collapse voltage as well as 136% 3 dB one-way fractional bandwidth at the transducer surface around the design frequency of 8 MHz. These results are within 5% of the predictions of the finite element simulations. The large bandwidth is achieved mainly by utilizing a non-uniform membrane, introducing center mass to the design, whereas the dual-electrode structure provides high coupling coefficient in a large dc bias range without collapsing the membrane. In addition, the non-uniform membrane structure improves the transmit sensitivity of the dual-electrode CMUT by about 2dB as compared with a dual electrode CMUT with uniform membrane.

Single chip CMUT arrays with integrated CMOS electronics: Fabrication process development and experimental results

One of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach maximizes transducer sensitivity by minimizing parasitic capacitances and ultimately improves the signal to noise ratio. Additionally, due to physical size limitations required for catheter based imaging devices, optimization of area occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication of CMUTs on custom designed CMOS electronics from a commercial IC foundry. This is achieved by modifying a low temperature micromachining process by adding one additional mask and developing a sloped wall dry etching step on isolation oxide layer for metal interconnect. Experiments show that both the CMUT and the integrated CMOS electronics are functional, resulting combination generating pulse-echo response suitable for ultrasound imaging.

A large-signal model for CMUT arrays with arbitrary membrane geometry operating in non-collapsed mode

A large-signal, transient model has been developed to predict the output characteristics of a CMUT array operated in the non-collapse mode. The model is based on separation of the nonlinear electrostatic voltage-to-force relation and the linear acoustic array response. For modeling of linear acoustic radiation and crosstalk effects, the boundary element method is used. The stiffness matrix in the vibroacoustics calculations is obtained using static finite element analysis of a single membrane which can have arbitrary geometry and boundary conditions. A lumped modeling approach is used to reduce the order of the system for modeling the transient nonlinear electrostatic actuation. To accurately capture the dynamics of the non-uniform electrostatic force distribution over the CMUT electrode during large deflections, the membrane electrode is divided into patches shaped to match higher order membrane modes, each introducing a variable to the system model. This reduced order nonlinear lumped model is solved in the time domain using commercial software. The model has two linear blocks to calculate the displacement profile of the electrode patches and the output pressure for a given force distribution over the array. The force-to-array-displacement block uses the linear acoustic model, and the Rayleigh integral is evaluated to calculate the pressure at any field point. Using the model, the time-domain transmitted pressure can be simulated for different large drive signal configurations. The acoustic model is verified by comparison to harmonic FEA in vacuum and fluid for high- and low-aspect-ratio membranes as well as mass-loaded membranes. The overall software model is verified by comparison to transient 3-D finite element analysis and experimental results for different large drive signals, and an example for a phased array simulation is given.

An Analog Integrated Circuit Beamformer for High-Frequency Medical Ultrasound Imaging

We designed and fabricated a dynamic receive beamformer integrated circuit (IC) in 0.35-μm CMOS technology. This beamformer IC is suitable for integration with an annular array transducer for high-frequency (30-50 MHz) intravascular ultrasound (IVUS) imaging. The beamformer IC consists of receive preamplifiers, an analog dynamic delay-and-sum beamformer, and buffers for 8 receive channels. To form an analog dynamic delay line we designed an analog delay cell based on the current-mode first-order all-pass filter topology, as the basic building block. To increase the bandwidth of the delay cell, we explored an enhancement technique on the current mirrors. This technique improved the overall bandwidth of the delay line by a factor of 6. Each delay cell consumes 2.1-mW of power and is capable of generating a tunable time delay between 1.75 ns to 2.5 ns. We successfully integrated the fabricated beamformer IC with an 8-element annular array. Experimental test results demonstrated the desired buffering, preamplification and delaying capabilities of the beamformer.

Characterization of dual-electrode CMUTs: demonstration of improved receive performance and pulse echo operation with dynamic membrane shaping

A 1-D dual-electrode CMUT array for intracardiac echocardiography (ICE) with a center frequency of 8 MHz has been designed, fabricated, and used to demonstrate the potential of dual-electrode CMUTs. Using a dual-electrode CMUT, 9 dB higher receive signal level is obtained over the 6 dB fractional bandwidth as compared with a conventional CMUT with an identical center electrode biased close to its collapse voltage. Because the same device shows a 7.4 dB increase in maximum pressure output, 16.4 dB overall improvement in transduction performance has been achieved as compared with conventional CMUT. A net peak output pressure of 1.6 MPa on the dual-electrode CMUT membrane with tone burst excitation at 12 MHz is also reported. The frequency response of the dual-electrode CMUT is similar to that of a conventional CMUT with the same membrane geometry with about 15% increase in the center frequency. Monostatic operation of dual-electrode CMUTs shows that the high performance of the transducer is applicable in typical pulse-echo imaging mode of operation. With dynamic shaping of the CMUT membrane to optimize the transmit-and-receive modes of operation separately during each pulse-echo cycle, dual-electrode CMUT is a highly competitive alternative to its piezoelectric counterparts.

5G-5 Dual-Annular-Ring CMUT Array for ForwardLooking IVUS Imaging

We investigate a dual-annular-ring CMUT array configuration for forward-looking intravascular ultrasound (FL-IVUS) imaging. The array consists of separate, concentric transmit and receive ring arrays built on the same silicon substrate. This configuration has the potential for independent optimization of each array and uses the silicon area more effectively without any particular drawback. We designed and fabricated a 1 mm diameter test array which consists of 24 transmit and 32 receive elements. We investigated synthetic phased array beamforming with a non-redundant subset of transmit-receive element pairs of the dual-annular-ring array. For imaging experiments, we designed and constructed a programmable FPGA-based data acquisition and phased array beamforming system. Pulse-echo measurements along with imaging simulations suggest that dual-ring-annular array should provide performance suitable for real-time FL-IVUS applications

P0-18 Forward-Looking IVUS Imaging Using a Dual-Annular Ring CMUT Array: Experimental Results

This paper presents the experimental results on forward-looking intravascular ultrasound (FL-IVUS) using dual- annular-ring CMUT arrays. The array has a diameter of 1mm including bondpads which consists of separate, concentric 24 transmit and 32 receive ring arrays built on the same silicon substrate. This configuration has the potential for independent optimization of each array and uses the silicon area more effectively without any drawback. For imaging experiments, we designed and constructed a custom integrated circuit using a standard 0.5mum CMOS process for data acquisition. A sample pulse-echo signal received from the oil-air interface (plane reflector) at 6 mm had a center frequency of 11 MHz with 95*% fractional 6-dB bandwidth. The measured SNR of the echo was 24 dB with no averaging. B-scan image of a wire-phantom was generated to test the resolution.

CMUT-on-CMOS for forward-looking IVUS: Improved fabrication and real-time imaging

The capability to monolithically integrate CMUTs with underlying front-end electronics is promising for forward-looking (FL) imaging catheters with improved SNR and smaller size. We previously demonstrated feasibility of CMUT-on-CMOS arrays for FL imaging and obtained pulse-echo results from individual elements. Here we describe recent improvements in the fabrication process and initial results from a test setup capable of real-time image data collection using CMUT-on-CMOS arrays. Dual-ring CMUT arrays were fabricated on silicon wafers with 0.35 µm CMOS front-end electronics processed at a commercial foundry. The critical changes made in the fabrication process involved in-house polishing followed by a chemical stripping of the aluminum oxide slurry. We also added 0.2 µm of silicon nitride before CMUT to CMOS interconnect via etching. We made these modifications to improve surface quality, alleviating wirebonding stiction issues. The real-time imaging test setup uses an FPGA to control Tx/Rx element selection and data collection functions. The Tx electronics are capable of generating high voltage, broadband, bipolar pulses up to 100V in amplitude. The 4 Rx channels coming out of the CMUT-on-CMOS chip are simultaneously digitized using a 14 bit 250 MS/s digitizer. 12 MHz dual-ring CMUT-on-CMOS arrays were used for real-time imaging of various targets. The results show that these arrays, coupled with an FPGA controlled data acquisition system, can produce true volumetric images in front of the array in real time.