Jay M. Shah

Experimental analysis and theoretical model for anomalously high ideality factors (n≫2.0) in AlGaN/GaN p-n junction diodes

Diode ideality factors much higher than the expected values of 1.0 to 2.0 have been reported in GaN-based p-n junctions. It is shown that moderately doped unipolar heterojunctions as well as metal-semiconductor junctions, in particular the metal contact to p-type GaN, can increase the ideality factor to values greater than 2.0. A relation is derived for the effective ideality factor by taking into account all junctions of the diode structure. Diodes fabricated from a bulk GaN p-n junction and a p-n junction structure with a p-type AlGaN/GaN superlattice display ideality factors of 6.9 and 4.0, respectively. These results are consistent with the theoretical model and the fact that p-type AlGaN/GaN superlattices facilitate the formation of low-resistance ohmic contacts.

Junction and carrier temperature measurements in deep-ultraviolet light-emitting diodes using three different methods

The junction temperature of AlGaN ultraviolet light-emitting diodes emitting at 295nm is measured by using the temperature coefficients of the diode forward voltage and emission peak energy. The high-energy slope of the spectrum is explored to measure the carrier temperature. A linear relation between junction temperature and current is found. Analysis of the experimental methods reveals that the diode-forward voltage is the most accurate (±3°C). A theoretical model for the dependence of the diode forward voltage (Vf) on junction temperature (Tj) is developed that takes into account the temperature dependence of the energy gap. A thermal resistance of 87.6K∕W is obtained with the device mounted with thermal paste on a heat sink.

Junction temperature in light-emitting diodes assessed by different methods

The junction temperature of red (AlGaInP), green (GaInN), blue (GaInN), and ultraviolet (GaInN) light-emitting diodes (LEDs) is measured using the temperature coefficients of the diode forward voltage and of the emission-peak energy. The junction temperature increases linearly with DC current as the current is increased from 10 mA to 100 mA. For comparison, the emission-peak-shift method is also used to measure the junction temperature. The emission-peak-shift method is in good agreement with the forward-voltage method. The carrier temperature is measured by the high-energy-slope method, which is found to be much higher than the lattice temperature at the junction. Analysis of the experimental methods reveals that the forward-voltage method is the most sensitive and its accuracy is estimated to be ± 3°C. The peak position of the spectra is influenced by alloy broadening, polarization, and quantum confined Stark effect thereby limiting the accuracy of the emission-peak-shift method to ±15°C. A detailed analysis of the temperature dependence of a tri-chromatic white LED source (consisting of three types of LEDs) is performed. The analysis reveals that the chromaticity point shifts towards the blue, the color-rendering index (CRI) decreases, the color temperature increases, and the luminous efficacy decreases as the junction temperature increases. A high CRI > 80 can be maintained, by adjusting the LED power so that the chromaticity point is conserved.

Junction Temperature in Ultraviolet Light-Emitting Diodes

The junction temperature and thermal resistance of AlGaN and GaInN ultraviolet (UV) light-emitting diodes (LEDs) emitting at 295 and 375 nm, respectively, are measured using the temperature coefficient of diode-forward voltage. An analysis of the experimental method reveals that the diode-forward voltage has a high accuracy of ±3°C. A comprehensive theoretical model for the dependence of diode-forward voltage (Vf) on junction temperature (Tj) is developed taking into account the temperature dependence of the energy gap and the temperature coefficient of diode resistance. The difference between the junction voltage temperature coefficient (dVj/dT) and the forward voltage temperature coefficient (dVf/dT) is shown to be caused by diode series resistance. The data indicate that the n-type neutral regions are the dominant resistive element in deep-UV devices. A linear relationship between junction temperature and current is found. Junction temperature is also measured by the emission-peak-shift method. The high-energy slope of the spectrum is explored in the measurement of carrier temperature.

Light Extraction in GaInN Light-Emitting Diodes using Diffuse Omnidirectional Reflectors

A theoretical and experimental analysis of light extraction in GaInN light-emitting diodes LEDs employing diffuse omnidirectional reflectors is presented. The diffuse omnidirectional reflector consists of GaN, a Ni/Au current spreading layer, a SiO2 layer roughened by Ar ion etching, and a Ag layer. Randomly distributed polystyrene spheres are used as an etch mask. The diffusely reflected power is enhanced by two orders of magnitude for a roughened reflector surface compared with a planar surface. The GaInN LEDs with diffuse omnidirectional reflectors show a higher light output 3.3% and a lower angular dependence of emission than LEDs with specular reflectors. The enhancement is attributed to reduced trapping of light within the high-index GaN semiconductor.

Experimental analysis and a new model for the high ideality factors in GaN-based diodes

In this paper, we described the fabrication of GaN based diodes from two different structures , a bulk GaN p-n junction structure and a p-n junction structure incorporating a p-type AlGaN/GaN superlattice. This superlattice structure is included to facilitate ohmic contact formation. We measure the I-V characteristics of the p-n junctions at room temperature. The lower ideality factor to the improved transport characteristics of p-type AlGaN/GaN superlattices are attributed. The temperature dependence of ideality factor is obtained by measuring the I-V characteristics of the GaN p-n juction with the superlattice structure at three different temperatures. In addition, contact become less rectifying at higher temperatures and hence result in more ohmic behavior. This decreases the ideality factor of the metal-semiconductor juction, which in turn reduces the overall ideality factor. This interpretation is in excellent agreement with the theoretical model and the experimental results.

Discrete Steps in the Capacitance-Voltage Characteristics of GaInN/GaN Light Emitting Diode Structures

A detailed modeling of the electronic bandstructure of GaInN alloys and GaInN/GaN heterostructures typically used for high efficiency light emitting diodes is of high relevance for future improvements. Here we are exploring opportunities to accurately quantify the carrier dynamics under forward and reverse voltage bias. In GaInN/GaN LED-type heterostructures we observe distinct steps in the junction capacitance as a function of bias voltage within the depletion regime. Up to three individual steps can be identified that correspond to alternating ranges of capacitive and resistive impedances. Our analysis suggests that we are quantitatively monitoring the electron concentration in each individual quantum well. The pronounced clarity of the data reveals a high level of epitaxial perfection and spatial homogeneity across the entire area of the junction.

Junction Temperature Measurements in Deep-UV Light-Emitting Diodes

The junction temperature of AlGaN/GaN ultraviolet (UV) Light-Emitting Diodes (LEDs) emitting at 295 nm is measured by using the temperature coefficients of the diode forward voltage and emission peak energy. The high-energy slope of the spectrum is explored to measure the carrier temperature. A linear relation between junction temperature and current is found. Analysis of the experimental methods reveals that the diode-forward voltage is the most accurate method (± 3 °C). A theoretical model for the dependence of the diode junction voltage ( V j ) on junction temperature ( T ) is developed that takes into account the temperature dependence of the energy gap. A thermal resistance of 87.6 K/W is obtained with the AlGaN/GaN LED sample mounted with thermal paste on a heat sink.

Reduction of Base Access Resistance in AlGaN/GaN Heterojunction Bipolar Transistors using GaInN Base Cap Layer and Selective Epitaxial Growth

One of the major challenges affecting the performance of Npn AlGaN/GaN heterojunction bipolar transistors (HBTs) is the high base access resistance, which is comprised of the base contact resistance and the base bulk resistance. A novel concept is proposed to reduce the base access resistance in Npn AlGaN/GaN HBTs by employing polarization-enhanced contacts and selective epitaxial growth of the base and emitter. In addition, this technique reduces the exposed base surface area, which results in a lower surface recombination current. Such a structure would enable better performance of AlGaN/GaN HBTs in terms of higher current gain and a lower offset voltage. Theoretical calculations on polarization-enhanced contacts predict p-type specific contact resistance lower than 10 –5 Ωcm 2 . Experimental results using transmission line measurement (TLM) technique yield specific contact resistances of 5.6×10 –4 Ωcm 2 for polarization-enhanced p-type contacts and 7.8×10 –2 Ωcm 2 for conventional p-type contacts.

Experimental Analysis and a New Theoretical Model for Anomalously High Ideality Factors ( n ≫ 2.0) in GaN-based p-n Junction Diodes

Diode ideality factors of 2.0–8.0 have been reported in GaN-based p-n junctions. These values are much higher than the expected values of 1.0–2.0 as per the Sah-Noyce-Shockley theory. We propose a fundamentally new model for the high ideality factors obtained in GaN-based diodes. This model is based on the effect of moderately doped unipolar heterojunctions as well as metal–semiconductor junctions in series with the p-n junction. A relation for the effective ideality factor of a system of junctions is developed. A detailed experimental study is performed on diodes fabricated from two different structures, a bulk GaN p-n junction structure and a p-n junction structure incorporating a p-type AlGaN/GaN superlattice. Bulk GaN p-n junction diode displays an ideality factor of 6.9, whereas the one with the superlattice structure displays an ideality factor of 4.0. In addition, device simulation results further strengthen the model by showing that moderately doped unipolar heterojunctions are rectifying and increase the effective ideality factor of a p-n junction structure.