Chen Hsien-Wei | Researchain

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Publication

Featured researches published by Chen Hsien-Wei.

Archive | 2013

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

Chen Hsien-Wei

Archive | 2010

Dies, stacked structures, and systems

Chen Hsien-Wei; Jeng Shin-Puu; Tu Hung-Jung; Chiou Wen-Chih

Archive | 2013

Protection sealing ring used for preventing stress caused by cutting die

Jeng Shin-Puu; Chen Hsien-Wei; Hou Shang-Yun; Tsai Hao-Yi; Wu Anbiarshy N F; Liu Yu-Wen

Archive | 2012

METHOD AND APPARATUS OF FABRICATING A PAD STRUCTURE FOR A SEMICONDUCTOR DEVICE

Chen Hsien-Wei

Archive | 2010

DIE, STACK STRUCTURE AND SYSTEM

Chen Hsien-Wei; Jeng Shin-Puu; Tu Hung-Jung; Chiou Wen-Chih

Archive | 2007

Reinforced interconnection structures

Chen Hsien-Wei

Archive | 2011

Corner Stress Release Structure Design for Increasing Circuit Routing Areas

Chen Hsien-Wei

Archive | 2017

Multi-Chip Packages with Multi-Fan-Out Scheme and Methods of Manufacturing the Same.

Chen Hsien-Wei; Chen Jie

Archive | 2016

Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices

Chen Hsien-Wei

Archive | 2012

A semiconductor structure and a forming method for a semiconductor device

Wang Tzu-Yu; Hsieh Chi-Chun; Su An-Jhih; Chen Hsien-Wei; Jeng Shin-Puu; Lin Liwei

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Collaboration

Dive into the Chen Hsien-Wei's collaboration.

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Yu Chen-Hua

TSMC

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Yeh Der-Chyang

TSMC

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Su An-Jhih

TSMC

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Tsai Hao-Yi

TSMC

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Chen Ying-Ju

TSMC

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Jeng Shin-Puu

TSMC

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Chen Jie

TSMC

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Huang Li-Hsien

TSMC

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Chen Wei-Yu

TSMC

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Wu Chi-Hsi

TSMC

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