Jeremy Lansford

Method and apparatus for monitoring consumable performance

Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad

Method and apparatus for controlling within-wafer uniformity in chemical mechanical polishing

Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer

Electrochemically generated reactants for chemical mechanical planarization

Chemical mechanical polishing with electrochemical control

Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication

Method and apparatus for controlling etch selectivity

Method of endpointing plasma strip process by measuring wafer temperature

Method and apparatus for providing etch uniformity using zoned temperature control