Jianqiu Chen

High-performance back-channel-etched thin-film transistors with amorphous Si-incorporated SnO2 active layer

In this report, back-channel-etched (BCE) thin-film transistors (TFTs) were achieved by using Si-incorporated SnO2 (silicon tin oxide (STO)) film as active layer. It was found that the STO film was acid-resistant and in amorphous state. The BCE-TFT with STO active layer exhibited a mobility of 5.91 cm2/V s, a threshold voltage of 0.4 V, an on/off ratio of 107, and a steep subthreshold swing of 0.68 V/decade. Moreover, the device had a good stability under the positive/negative gate-bias stress.

Direct Inkjet Printing of Silver Source/Drain Electrodes on an Amorphous InGaZnO Layer for Thin-Film Transistors

Printing technologies for thin-film transistors (TFTs) have recently attracted much interest owing to their eco-friendliness, direct patterning, low cost, and roll-to-roll manufacturing processes. Lower production costs could result if electrodes fabricated by vacuum processes could be replaced by inkjet printing. However, poor interfacial contacts and/or serious diffusion between the active layer and the silver electrodes are still problematic for achieving amorphous indium–gallium–zinc–oxide (a-IGZO) TFTs with good electrical performance. In this paper, silver (Ag) source/drain electrodes were directly inkjet-printed on an amorphous a-IGZO layer to fabricate TFTs that exhibited a mobility of 0.29 cm2·V−1·s−1 and an on/off current ratio of over 105. To the best of our knowledge, this is a major improvement for bottom-gate top-contact a-IGZO TFTs with directly printed silver electrodes on a substrate with no pretreatment. This study presents a promising alternative method of fabricating electrodes of a-IGZO TFTs with desirable device performance.

Direct patterning of silver electrodes with 2.4 μm channel length by piezoelectric inkjet printing

The control of channel length is of great significance in the fabrication of thin film transistors (TFTs) with high-speed operation. However, achieving short channel on untreated glass by traditional piezoelectric inkjet printing is problematic due to the impacting and rebounding behaviors of droplet impinging on solid surface. Here a novel method was proposed to obtain short channel length on untreated glass by taking advantage of the difference in the retraction velocities on both sides of an ink droplet. In addition, droplets contact mechanism was first introduced in our work to explain the formation of short channel in the printing process. Through printing droplets array with optimized drop space and adjusting appropriate printing parameters, a 2.4μm of channel length for TFT, to the best of our knowledge, which is the shortest channel on substrate without pre-patterning, was achieved using piezoelectric inkjet printing. This study sheds light on the fabrication of short channel TFT for large size and high-resolution displays using inkjet printing technology.

Effect of Intrinsic Stress on Structural and Optical Properties of Amorphous Si-Doped SnO2 Thin-Film

The effect of intrinsic stress on the structure and physical properties of silicon-tin-oxide (STO) films have been investigated. Since a state of tensile stress is available in as-deposited films, the value of stress can be exponentially enhanced when the annealing temperature is increased. The tensile stress is able to not only suppress the crystallization and widen the optical band gap of STO films, but also reduce defects of STO films. In this report, the good electrical performance of STO thin-film transistors (TFTs) can be obtained when annealing temperature is 450 °C. This includes a value of saturation mobility that can be reached at 6.7 cm2/Vs, a ratio of Ion/Ioff as 7.34 × 107, a steep sub-threshold swing at 0.625 V/decade, and a low trap density of 7.96 × 1011 eV−1·cm−2, respectively.

All-Aluminum Thin Film Transistor Fabrication at Room Temperature

Bottom-gate all-aluminum thin film transistors with multi conductor/insulator nanometer heterojunction were investigated in this article. Alumina (Al2O3) insulating layer was deposited on the surface of aluminum doping zinc oxide (AZO) conductive layer, as one AZO/Al2O3 heterojunction unit. The measurements of transmittance electronic microscopy (TEM) and X-ray reflectivity (XRR) revealed the smooth interfaces between ~2.2-nm-thick Al2O3 layers and ~2.7-nm-thick AZO layers. The devices were entirely composited by aluminiferous materials, that is, their gate and source/drain electrodes were respectively fabricated by aluminum neodymium alloy (Al:Nd) and pure Al, with Al2O3/AZO multilayered channel and AlOx:Nd gate dielectric layer. As a result, the all-aluminum TFT with two Al2O3/AZO heterojunction units exhibited a mobility of 2.47 cm2/V·s and an Ion/Ioff ratio of 106. All processes were carried out at room temperature, which created new possibilities for green displays industry by allowing for the devices fabricated on plastic-like substrates or papers, mainly using no toxic/rare materials.

A novel nondestructive testing method for amorphous Si–Sn–O films

Traditional methods to evaluate the quality of amorphous silicon-substituted tin oxide (a-STO) semiconductor film are destructive and time-consuming. Here, a novel non-destructive, quick, and facile method named microwave photoconductivity decay (μ-PCD) is utilized to evaluate the quality of a-STO film for back channel etch (BCE) thin-film transistors (TFTs) by simply measuring the D value and peak reflectivity signal. Through the μ-PCD method, both optimum deposition procedure and optimal annealing temperature are attained to prepare a-STO film with superior quality. The a-STO TFTs are fabricated by the obtained optimum procedure that exhibits a mobility of 8.14 cm2 V−1 s−1, a I on/I off ratio of 6.07 × 109, a V on of -1.2 V, a steep subthreshold swing of 0.21 V/decade, a low trap density (D t) of 1.68 × 1012 eV−1 cm−2, and good stability under the positive/negative gate-bias stress. Moreover, the validity of the μ-PCD measurement for a-STO films is verified by x-ray photoelectron spectroscopy, Hall effect measurement, and the performance of STO TFTs measured by traditional methods. The non-destructive μ-PCD method sheds light on the fast optimization of the deposition procedure for amorphous oxide semiconductor films with excellent quality.

Critical Impact of Solvent Evaporation on the Resolution of Inkjet Printed Nanoparticles Film

We first verify the critical role of solvent evaporation on the resolution of inkjet printing. To confirm our hypothesis, we adjusted the evaporation rate gradient along the surface of adjacent droplets by controlling the drying microenvironment. Uneven solvent evaporation flux caused thermocapillary surface flow inward the space of micrometer-sized droplets and increase the air pressure, which prevented the neighboring droplets from coalescence. When reducing the droplet distance by the solvent evaporation-based method, a uniform profile could be obtained at the same time. This work brings us a step closer to resolving one of the critical bottlenecks to commercializing printed electronic goods.