Ruiqiang Tao

Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs

We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm2·V−1·s−1 a turn-on voltage of −0.8 V and a low subthreshold swing of 0.47 V/decade. Cu diffusion is suppressed because pre-annealing can protect a-IGZO from damage during the electrode sputtering and reduce the copper diffusion paths by making film denser. Due to the interaction of Cr with a-IGZO, the carrier concentration of a-IGZO, which is responsible for high mobility, rises.

High-performance back-channel-etched thin-film transistors with amorphous Si-incorporated SnO2 active layer

In this report, back-channel-etched (BCE) thin-film transistors (TFTs) were achieved by using Si-incorporated SnO2 (silicon tin oxide (STO)) film as active layer. It was found that the STO film was acid-resistant and in amorphous state. The BCE-TFT with STO active layer exhibited a mobility of 5.91 cm2/V s, a threshold voltage of 0.4 V, an on/off ratio of 107, and a steep subthreshold swing of 0.68 V/decade. Moreover, the device had a good stability under the positive/negative gate-bias stress.

Direct Inkjet Printing of Silver Source/Drain Electrodes on an Amorphous InGaZnO Layer for Thin-Film Transistors

Printing technologies for thin-film transistors (TFTs) have recently attracted much interest owing to their eco-friendliness, direct patterning, low cost, and roll-to-roll manufacturing processes. Lower production costs could result if electrodes fabricated by vacuum processes could be replaced by inkjet printing. However, poor interfacial contacts and/or serious diffusion between the active layer and the silver electrodes are still problematic for achieving amorphous indium–gallium–zinc–oxide (a-IGZO) TFTs with good electrical performance. In this paper, silver (Ag) source/drain electrodes were directly inkjet-printed on an amorphous a-IGZO layer to fabricate TFTs that exhibited a mobility of 0.29 cm2·V−1·s−1 and an on/off current ratio of over 105. To the best of our knowledge, this is a major improvement for bottom-gate top-contact a-IGZO TFTs with directly printed silver electrodes on a substrate with no pretreatment. This study presents a promising alternative method of fabricating electrodes of a-IGZO TFTs with desirable device performance.

Direct patterning of silver electrodes with 2.4 μm channel length by piezoelectric inkjet printing

The control of channel length is of great significance in the fabrication of thin film transistors (TFTs) with high-speed operation. However, achieving short channel on untreated glass by traditional piezoelectric inkjet printing is problematic due to the impacting and rebounding behaviors of droplet impinging on solid surface. Here a novel method was proposed to obtain short channel length on untreated glass by taking advantage of the difference in the retraction velocities on both sides of an ink droplet. In addition, droplets contact mechanism was first introduced in our work to explain the formation of short channel in the printing process. Through printing droplets array with optimized drop space and adjusting appropriate printing parameters, a 2.4μm of channel length for TFT, to the best of our knowledge, which is the shortest channel on substrate without pre-patterning, was achieved using piezoelectric inkjet printing. This study sheds light on the fabrication of short channel TFT for large size and high-resolution displays using inkjet printing technology.

All-Aluminum Thin Film Transistor Fabrication at Room Temperature

Bottom-gate all-aluminum thin film transistors with multi conductor/insulator nanometer heterojunction were investigated in this article. Alumina (Al2O3) insulating layer was deposited on the surface of aluminum doping zinc oxide (AZO) conductive layer, as one AZO/Al2O3 heterojunction unit. The measurements of transmittance electronic microscopy (TEM) and X-ray reflectivity (XRR) revealed the smooth interfaces between ~2.2-nm-thick Al2O3 layers and ~2.7-nm-thick AZO layers. The devices were entirely composited by aluminiferous materials, that is, their gate and source/drain electrodes were respectively fabricated by aluminum neodymium alloy (Al:Nd) and pure Al, with Al2O3/AZO multilayered channel and AlOx:Nd gate dielectric layer. As a result, the all-aluminum TFT with two Al2O3/AZO heterojunction units exhibited a mobility of 2.47 cm2/V·s and an Ion/Ioff ratio of 106. All processes were carried out at room temperature, which created new possibilities for green displays industry by allowing for the devices fabricated on plastic-like substrates or papers, mainly using no toxic/rare materials.

A novel nondestructive testing method for amorphous Si–Sn–O films

Traditional methods to evaluate the quality of amorphous silicon-substituted tin oxide (a-STO) semiconductor film are destructive and time-consuming. Here, a novel non-destructive, quick, and facile method named microwave photoconductivity decay (μ-PCD) is utilized to evaluate the quality of a-STO film for back channel etch (BCE) thin-film transistors (TFTs) by simply measuring the D value and peak reflectivity signal. Through the μ-PCD method, both optimum deposition procedure and optimal annealing temperature are attained to prepare a-STO film with superior quality. The a-STO TFTs are fabricated by the obtained optimum procedure that exhibits a mobility of 8.14 cm2 V−1 s−1, a I on/I off ratio of 6.07 × 109, a V on of -1.2 V, a steep subthreshold swing of 0.21 V/decade, a low trap density (D t) of 1.68 × 1012 eV−1 cm−2, and good stability under the positive/negative gate-bias stress. Moreover, the validity of the μ-PCD measurement for a-STO films is verified by x-ray photoelectron spectroscopy, Hall effect measurement, and the performance of STO TFTs measured by traditional methods. The non-destructive μ-PCD method sheds light on the fast optimization of the deposition procedure for amorphous oxide semiconductor films with excellent quality.

Effects of Annealing Temperature on Optical Band Gap of Sol-gel Tungsten Trioxide Films

Tungsten trioxide (WO3) is a wide band gap semiconductor material that is used as an important electrochromic layer in electrochromic devices. In this work, the effects of the annealing temperature on the optical band gap of sol-gel WO3 films were investigated. X-ray Diffraction (XRD) showed that WO3 films were amorphous after being annealed at 100 °C, 200 °C and 300 °C, respectively, but became crystallized at 400 °C and 500 °C. An atomic force microscope (AFM) showed that the crystalline WO3 films were rougher than the amorphous WO3 films (annealed at 200 °C and 300 °C). An ultraviolet spectrophotometer showed that the optical band gap of the WO3 films decreased from 3.62 eV to 3.30 eV with the increase in the annealing temperature. When the Li+ was injected into WO3 film in the electrochromic reaction, the optical band gap of the WO3 films decreased. The correlation between the optical band gap and the electrical properties of the WO3 films was found in the electrochromic test by analyzing the change in the response time and the current density. The decrease in the optical band gap demonstrates that the conductivity increases with the corresponding increase in the annealing temperature.

Critical Impact of Solvent Evaporation on the Resolution of Inkjet Printed Nanoparticles Film

We first verify the critical role of solvent evaporation on the resolution of inkjet printing. To confirm our hypothesis, we adjusted the evaporation rate gradient along the surface of adjacent droplets by controlling the drying microenvironment. Uneven solvent evaporation flux caused thermocapillary surface flow inward the space of micrometer-sized droplets and increase the air pressure, which prevented the neighboring droplets from coalescence. When reducing the droplet distance by the solvent evaporation-based method, a uniform profile could be obtained at the same time. This work brings us a step closer to resolving one of the critical bottlenecks to commercializing printed electronic goods.

Highly conductive AZO thin films obtained by rationally optimizing substrate temperature and oxygen partial pressure

ABSTRACT In this work, an optimal procedure was proposed to prepare aluminum-doped zinc oxide (AZO) thin films with a sheet resistance of 17.03 Ω/sq by rationally optimizing oxygen partial pressure and substrate temperature. The results showed that increased temperature has an improving trend in the resistivity of AZO thin films while elevated oxygen partial pressure exhibited a deteriorating trend. With rising of substrate temperature in an oxygen-rich atmosphere, oxygen adsorption phenomenon gets stronger. Adsorbed oxygen atoms or molecules suppress the formation of oxygen vacancy and trap electrons, which is responsible for the increase of resistivity. Besides, atomic force microscope analysis indicated that surface roughness of AZO thin films decreases as increase of substrate temperature.

Performance analysis of pre-oxidation process direct bonding copper substrate

This paper represented the electrical and heat-resistant performance and uniformity of pre-oxidation process direct bonding copper substrate. Contrasting the difference between the raw alumina substrate and direct bonding copper substrate, there is no obvious change in the dielectric dissipation (tgδ); and a little change in the relative dielectric constant (ε). By the electronic speckle pattern interferometer (ESPI), the changes of pre-oxidation process direct bonding copper substrate were analyzed, there are no obvious defects emerging or extending under 100-300°C thermal shock. It proves pre-oxidation process direct bonding copper substrate can be used in high temperature, high frequency and low resistance bus line application field.