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Dive into the research topics where Jihun Jung is active.

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Featured researches published by Jihun Jung.


Journal of Semiconductor Technology and Science | 2014

Efficient Parallel Scan Test Technique for Cores on AMBA-based SoC

Jaehoon Song; Jihun Jung; Dooyoung Kim; Sungju Park

Today’s System-on-a-Chip (SoC) is designed with reusable IP cores to meet short time-tomarket requirements. However, the increasing cost of testing becomes a big burden in manufacturing a highly integrated SoC. In this paper, an efficient parallel scan test technique is introduced to minimize the test application time. Multiple scan enable signals are adopted to implement scan architecture to achieve optimal test application time for the test patterns scheduled for concurrent scan test. Experimental results show that testing times are considerably reduced with little area overhead.


Journal of Semiconductor Technology and Science | 2012

Efficient Use of Unused Spare Columns for Reducing Memory Miscorrections

Jihun Jung; Umair Ishaq; Jae-Hoon Song; Sungju Park

In the deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories increasingly vulnerable to reliability and yield problems. Spare columns are often included in memories to repair defective cells or bit lines during production test. In many cases, the repair process will not use all spare columns. Schemes have been proposed to exploit these unused spare columns to store additional check bits which can be used to reduce the miscorrection probability for triple errors in single error correction?double error detection (SEC-DED). These additional check bits increase the dimensions of the parity check matrix (H-matrix) requiring extra area overhead. A method is proposed in this paper to efficiently fill the extra rows of the H-matrix on the basis of similarity of logic between the other rows. Optimization of the whole Hmatrix is accomplished through logic sharing within a feasible operating time resulting in reduced area overhead. A detailed implementation using fuse technology is also proposed in this paper.


Journal of Semiconductor Technology and Science | 2015

Hybrid Test Data Transportation Scheme for Advanced NoC-Based SoCs

M. Adil Ansari; Dooyoung Kim; Jihun Jung; Sungju Park

Network-on-chip (NoC) has evolved to overcome the issues of traditional bus-based on-chip interconnect. In NoC-reuse as TAM, the test schedulers are constrained with the topological position of cores and test access points, which may negatively affect the test time. This paper presents a scalable hybrid test data transportation scheme that allows to simultaneously test multiple heterogeneous cores of NoC-based SoCs, while reusing NoC as TAM. In the proposed test scheme, single test stimuli set of multiple CUTs is embedded into each flit of the test stimuli packets and those packets are multicast to the targeted CUTs. However, the test response packets of each CUT are unicast towards the tester. To reduce network load, a flit is filled with maximum possible test response sets before unicasting towards the tester. With the aid of Verilog and analytical simulations, the proposed scheme is proved effective and the results are compared with some recent techniques.


asian test symposium | 2011

Efficient Use of Unused Spare Columns to Improve Memory Error Correcting Rate

Umair Ishaq; Jihun Jung; Jaehoon Song; Sungju Park

In the deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories increasingly vulnerable to reliability and yield problems. Spare columns are often included in memories to repair defective cells or bit lines during production test. In many cases, the repair process will not use all spare columns. Schemes have been proposed to exploit these unused spare columns to store additional check bits which can be used to reduce the miscorrection probability for triple errors in single error correction -- double error detection (SEC-DED). These additional check bits increase the dimensions of the parity check matrix (H-matrix) requiring extra area and delay overhead. A method is proposed in this paper to efficiently fill the extra rows of the H-matrix on the basis of similarity of logic between the other rows. Optimization of the whole H-matrix is accomplished through logic sharing within a feasible operating time resulting in the reduced area and delay overhead.


Journal of Semiconductor Technology and Science | 2012

An Efficient Technique to Protect AES Secret Key from Scan Test Channel Attacks

Jaehoon Song; Taejin Jung; Jihun Jung; Sungju Park

Scan techniques are almost mandatorily adopted in designing current System-on-a-Chip (SoC) to enhance testability, but inadvertently secret keys can be stolen through the scan test channels of crypto SoCs. An efficient scan design technique is proposed in this paper to protect the secret key of an Advanced Encryption Standard (AES) core embedded in an SoC. A new instruction is added to IEEE 1149.1 boundary scan to use a fake key instead of user key, in which the fake key is chosen with meticulous care to improve the testability as well. Our approach can be implemented as user defined logic with conventional boundary scan design, hence no modification is necessary to any crypto IP core. Conformance to the IEEE 1149.1 standards is completely preserved while yielding better performance of area, power, and fault coverage with highly robust protection of the secret user key.


IEEE Transactions on Circuits and Systems Ii-express Briefs | 2017

On Diagnosing the Aging Level of Automotive Semiconductor Devices

Jihun Jung; Muhammad Adil Ansari; Dooyoung Kim; Hyunbean Yi; Sungju Park

Semiconductor aging is a serious threat to the reliability of a system. We address the aging level of semiconductor components by describing the degree of semiconductor aging under certain operating conditions, including voltage, frequency, temperature, and usage rate. Aging level information can be used to follow the real aging rate of a device, predict the remaining life, and control the device performance under certain degradation conditions by balancing the operation of various device components. Such applications can improve the reliability of automotive semiconductor systems, which should have longer lives than mobile systems. In this brief, we present an aging level estimating flip-flop (FF) that can be used for these and other applications as well. Moreover, we can control the operation of the proposed FF by controlling its clock and control signals. We demonstrate an application of the proposed FF for aging-monitoring, showing that, by halting the operation of the proposed FF, the power consumption is significantly reduced compared with other approaches.


Journal of Semiconductor Technology and Science | 2016

Low Power Scan Chain Reordering Method with Limited Routing Congestion for Code-based Test Data Compression

Dooyoung Kim; M. Adil Ansari; Jihun Jung; Sungju Park

Various test data compression techniques have been developed to reduce the test costs of system–on–a–chips. In this paper, a scan chain reordering algorithm for code–based test data compression techniques is proposed. Scan cells within an acceptable relocation distance are ranked to reduce the number of conflicts in all test patterns and rearranged by a positioning algorithm to minimize the routing overhead. The proposed method is demonstrated on ISCAS ’89 benchmark circuits with their physical layout by using a 180 nm CMOS process library. Significant improvements are observed in compression ratio and test power consumption with minor routing overhead.


Journal of Semiconductor Technology and Science | 2016

Efficient Pre-Bond Testing of TSV Defects Based on IEEE std. 1500 Wrapper Cells

Jihun Jung; Muhammad Adil Ansari; Dooyoung Kim; Sungju Park

The yield of 3D stacked IC manufacturing improves with the pre-bond integrity testing of through silicon vias (TSVs). In this paper, an efficient pre-bond test method is presented based on IEEE std. 1500, which can precisely diagnose any happening of TSV defects. The IEEE std. 1500 wrapper cells are augmented for the proposed method. The pre-bond TSV test can be performed by adjusting the driving strength of TSV drivers and the test clock frequency. The experimental results show the advantages of the proposed approach.


IEICE Electronics Express | 2016

Time-multiplexed test access architecture for stacked integrated circuits

Muhammad Adil Ansari; Jihun Jung; Dooyoung Kim; Sungju Park

Due to ever-increasing gap between (1) the tester-channel and scan-shift frequencies, and (2) the wafer-level and package-level test frequencies, the tester-channel frequency is underutilized for stacked-ICs. Thus, we present a novel time-multiplexed test access architecture for SICs that complies with P1838 and it significant reduces test time, which reduction is observed on a synthetic SIC based on ITC’02 benchmark SoCs.


Journal of Semiconductor Technology and Science | 2018

Cost-efficient Chip Identification Method using Scan Flip-flop based Physically Unclonable Function

Dooyoung Kim; M. Adil Ansari; Jihun Jung; Jinuk Kim; Sungju Park

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Hyunbean Yi

Hanbat National University

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