Jin-Yub Lee

A 64-Mbit, 640-MByte/s bidirectional data strobed, double-data-rate SDRAM with a 40-mW DLL for a 256-MByte memory system

A 64-Mbit bidirectional data strobed, double-data-rate SDRAM achieves a peak bandwidth of 2.56 GByte/s on a 64-bit-channel, 256-MByte memory system at V/sub cc/=3.3 V and T=25/spl deg/C. The circuit features are: (1) a bidirectional data strobing scheme to eliminate the clock-related skews of I/O data in a multimodule system, (2) a low-power delay-locked loop having a wide range of locking frequency (40-160 MHz) with fast access time and minimal variations, and (3) a twisted data bussing architecture with minimized loading difference between I/O data paths and small chip-size overhead associated with the 2-bit prefetch operation.

High-Voltage Analog System for a Mobile NAND Flash

High-voltage analog circuits, including a novel high-voltage regulation scheme, are presented with emphasis on low supply voltage, low power consumption, low area overhead, and low noise, which are key design metrics for implementing NAND Flash memory in a mobile handset. Regulated high voltage generation at low supply voltage is achieved with optimized oscillator, high-voltage charge pump, and voltage regulator circuits. We developed a design methodology for a high-voltage charge pump to minimize silicon area, noise, and power consumption of the circuit without degrading the high-voltage output drive capability. Novel circuit techniques are proposed for low supply voltage operation. Both the oscillator and the regulator circuits achieve 1.5 V operation, while the regulator includes a ripple suppression circuit that is simple and robust. Through the paper, theoretical analysis of the proposed circuits is provided along with Spice simulations. A mobile NAND Flash device is realized with an advanced 63 nm technology to verify the operation of the proposed circuits. Extensive measurements show agreement with the results predicted by both analysis and simulation.

11.4 A 512Gb 3b/cell 64-stacked WL 3D V-NAND flash memory

The advent of emerging technologies such as cloud computing, big data, the internet of things and mobile computing is producing a tremendous amount of data. In the era of big data, storage devices with versatile characteristics are required for ultra-fast processing, higher capacity storage, lower cost, and lower power operation. SSDs employing 3D NAND are a promising to meet these requirements. Since the introduction of 3D NAND technology to marketplace in 2014 [1], the memory array size has nearly doubled every year [2,3]. To continue scaling 3D NAND array density, it is essential to scale down vertically to minimize total mold height. However, vertical scaling results in critical problems such as increasing WL capacitance and non-uniformity of stacked WLs due to variation in the channel hole diameter. To tackle these issues, this work proposes schemes for programming speed improvement and power reduction, and on-chip processing algorithms for error correction.

7.5 A 128Gb 2b/cell NAND flash memory in 14nm technology with tPROG=640µs and 800MB/s I/O rate

NAND flash memory is widely used as a cost-effective storage with high performance [1-2]. This paper presents a 128Gb multi-level cell (MLC) NAND flash memory with a 150 cells/string structure in 14nm CMOS that can be used as a cost-effective storage device. This paper also introduces several approaches to compensate for reliability and performance degradations caused by the 14nm transistors and the 150 cells/string structure. A technique was developed to suppress the background pattern dependency (BPD) by applying a low voltage to upper word lines (WLs) - the drain side(SSL side) WLs with respect to the location of the selected WL - during the verify sequence. Two techniques are also used to improve the program performance: equilibrium pulse scheme and smart start bias control scheme (SBC) in the MSB page. In addition, the first cycle recovery (FCR) of read enable (RE) and the bi-directional data strobe (DQS) is used to achieve a high speed I/O rate. As a result, a 640μs program time and a 800MB/s I/O rate is achieved.

A 1.2V 1.33Gb/s/pin 8Tb NAND flash memory multi-chip package employing F-chip for low power and high performance storage applications

A 1.2 V 1.33Gb/s/pin 8Tb NAND flash memory multi-chip package incorporating 16-die stacked 512-Gb NAND flash memories and F-Chip is presented. To meet the performance requirements of storage devices for higher capacity and faster data throughput, the 2nd generation F-Chip is developed. The F-Chip presents a dual bi-directional transceiver architecture including data retiming and training techniques to adaptively improve signal integrity. Besides, the F-Chip supports 1.2 V I/O for low power storage applications. This work, as a result, shows 33% improvement of eye-opening performances and 41% reduction of I/O power consumption compared to the previous generation.