Jindo Byun

Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider

In this paper, a multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is investigated. In a previous research (Eom , 2009), the four-way power division was studied by a 3-D mode coupling method, which was achieved by a vertical Y-junction as well as a lateral Y-junction of half mode substrate integrated waveguides (HMSIW) using a multilayer substrate. In this research, resistive coupling slots, for obtaining good isolation between four output ports and impedance matching at all the ports, are realized on the lateral HMSIW Y-junctions and the vertical HMSIW Y-junctions using isolation resistors. From the measurement results, excellent performances of insertion loss, isolation, impedance matching, and amplitude balancing were simultaneously achieved for the X-band range. It is expected that the proposed design of a multilayer substrate integrated waveguide (ML-SIW) power divider will play an important role in the future integration of compact multiway SIW circuits and systems.

Substrate Integraged Waveguide Wilkinson Power Divider with Improved Isolation Performance

This work proposes a substrate integrated waveguide (SIW) power divider employing the Wilkinson conflguration for improving the isolation performance of conventional T-junction SIW power dividers. Measurement results at 15GHz show that the isolation (S23, S32) between output ports is about 17dB and the output return losses (S22, S33) are about 14.5dB, respectively. The Wilkinson-type performance has been greatly improved from those (7:0dB » 8:0dB) of conventional T-junction SIW power dividers. The measured input return loss (23dB) and average insertion loss (3.9dB) are also improved from those of conventional ones. The proposed Wilkinson SIW divider will play an important role in high performance SIW circuits involving power divisions.

Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques

This paper characterizes the electrical performance of a probe card that is currently used for the test of memory devices operating at 300 MHz. The large printed circuit board assembly of the probe card has been found to consume 70% of the total signal transmission loss. We propose a simultaneous application of the back-drilling and the equalization techniques that greatly improve the signal integrity (SI) by reduction of the insertion loss and by planarization of the frequency response, respectively. These techniques are very simple and easy to be implemented by the numerical control of the drilling equipment and the surface mount technology. The Δ 3-dB bandwidth has greatly been improved from 0.66 GHz of the conventional probe card to 2.46 GHz after both of the equalization and the back-drilling. We also achieved 53% reductions of the transition times (Tr/Tf) and 51% improvement of the peak-to-peak jitter. We expect the simultaneous application of the back-drilling and the equalization be effectively used for further improvements of current wafer-level probe card performance.

Multi-layer four-way out-of-phase power divider for substrate integrated waveguide applications

In this paper, a novel multi-layer four-way out-of-phase power divider based on substrate integrated waveguide (SIW) is proposed. The four-way power division is realized by 3-D mode coupling; vertical partitioning of a SIW followed by lateral coupling to two half-mode SIW. The measurement results show the excellent insertion loss (S<inf>21</inf>, S<inf>31</inf>, S<inf>41</inf>, S<inf>51</inf>: −7.0 ± 0.5 dB) and input return loss (S<inf>11</inf>: −10 dB) in X-band (7.63 GHz ∼ 11.12 GHz). We expect that the proposed power divider play an important role for the integration of compact multi-way SIW circuits.

Substrate integrate waveguide quasi Yagi antenna using SIW-to-CPS transition for low mutual coupling

Rectangular waveguides of large size and high cost are widely used for low loss and high power microwave and millimeter-wave communication system. Recently, a new technique, substrate integrated waveguide (SIW) has been constructed by two parallel rows of via holes in a metalized planar substrate. The SIW has merits of low cost, low profile, and easy integration with planar circuits [1]. Therefore, the SIW technology has great potential for a wide range of applications such as filters, power dividers, and antennas [1]-[3].

Signal integrity and reliability of a new Multi-Stack Package using a Pressure Conductive Rubber

A proposed Pressure Conductive Rubber (PCR) is used instead of conventional interconnections such as wire and solder bondings for a Multi-Stack Package (MSP). A PCR for a three-dimensional (3-D) high-density interconnection has a major advantage in that it can replace defective dies with known good dies (KGD). In the structure of the PCR in this study working through external pressure, conductive particles are arranged between insulating rubber. To compare the RF electrical performance of the PCR and the solder interconnection, a test-jig with coplanar waveguide (CPW) was assembled. S-parameters and reliability tests of MSP formations using the PCR and solder interconnection were separately measured in a frequency range from 300 KHz to 8 GHz. The measured results show the insertion loss of 1.72 dB and the return loss of 12.7 dB on a single-layer structure at 8 GHz. Additionally, reliability tests of the PCR show stable electrical performance. These results indicate that the RF electrical performance of the PCR is acceptable for use in DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random Access Memory) applications.

SIW Slot Array Antenna for Dual-Polarization Phased Array System

In this paper, we propose a SIW(Substrate Integrated Waveguide) slot array antenna for dual-polarized phased array system. The basic part of the array is a subarray comprising an vertical-polarization and horizontal-polarization. A vertical-polarization slotted SIW single-polarization linear array. Using SIW, A vertical polarization linear array consists of 8 uniform longitudinal slots and 4-way SIW feeding network. Using HMSIW, horizontal-polarization linear array consists of 8 slots and 4-way SIW feeding network.

Composite EBG Power Plane Using Magnetic Materials for SSN Suppression in High-Speed Digital Circuits

In this paper, a new composite electromagnetic bandgap(EBG) structure using magnetic materials is proposed for simultaneous switching noise(SSN) suppression in the high-speed digital circuits. The proposed EBG structure has periodic unit cells of square-patches connected by spiral-shaped bridges. The magnetic materials are located on the unit cells of spiral-shaped EBG. The real part of the permeability shifts bandgap to the lower frequency region due to the increased effective inductance. The imaginary part of the permeability has magnetic loss that decreases parasitic LC resonance peaks from between the unit cells. As a result, the proposed structure has the lower cut-off frequency compared with conventional EBG structure and -30 dB SSN suppression bandwidth from 175 MHz to 7.7 GHz. The proposed structure is expected to improve the power integrity and reduce the size of the EBG power plane.

Compact ridged substrate integrated waveguide cavity backed slot antenna

A compact ridged substrate integrated waveguide (SIW) cavity backed slot antenna (CBSA) is proposed and implemented for a massive MIMO base station antenna system with very high spectral efficiency. The ridge of the SIW cavity is adopted to reduce the volume of the CBSA and the transverse slot length on the cavity. The size of the cavity is about 35 mm × 25 mm × 2.12 mm (corresponding to 0.31 λ₀ × 0.22 λ₀ × 0.019 λ₀). The measured results are in very good agreement with the simulated data. The proposed compact antenna is suitable for the massive MIMO array system by providing high efficiency and low mutual coupling array performance.

Punched-SIW Multi-Section E-Plane Transformer

In this paper, we propose an SIW(Substrate Integrated Waveguide) multi-section E-plane transformer using air-holes for an SIW system with variable thicknesses. Air-holes are inserted into a SIW E-plane quarter wavelength transformer for matching an E-plane impedance discontinuity. A PSIW(Punched Substrate Integrated Waveguide) consisted of air-holes has an SIW characteristic impedance tunability because of reducing a equivalent shunt capacitance of the SIW. And, a PSIW multi-section E-plane transformer is implemented for improving a matching bandwidth by using the Chebyshev polynomial. The measurement results of PSIW double-section E-plane transformer show that the insertion loss() is dB and input return loss() is more than 15 dB from 11.45 GHz to 13.6 GHz.