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Dive into the research topics where Jingbin Feng is active.

Publication


Featured researches published by Jingbin Feng.


Archive | 1998

Electric potential shaping apparatus for holding a semiconductor wafer during electroplating

Robert J. Contolini; Jonathan D. Reid; Evan E. Patton; Jingbin Feng; Steve Taatjes; John O. Dukovic


Archive | 1997

Electric potential shaping method for electroplating

Robert J. Contolini; Jonathan D. Reid; Evan E. Patton; Jingbin Feng; Steve Taatjes; John O. Dukovic


Archive | 2003

Wafer chuck for use in edge bevel removal of copper from silicon wafers

Steven T. Mayer; Steve Taatjes; Andy McCutcheon; Jim Schall; Jingbin Feng


Archive | 2008

Electroplating Apparatus with Vented Electrolyte Manifold

Jingbin Feng; Zhian He; Robert Rash; Steven T. Mayer


Archive | 2012

Plating method and apparatus with multiple internally irrigated chambers

Steven T. Mayer; Shantinath Ghongadi; Kousik Ganesan; Zhian He; Jingbin Feng


Archive | 2013

ELECTROFILL VACUUM PLATING CELL

R. Marshall Stowell; Jingbin Feng; David W. Porter


Archive | 2005

Small-volume electroless plating cell

Jingbin Feng; Steven T. Mayer; Daniel Mark Dinneen; Edmund B. Minshall; Christopher M. Bartlett; Eric G. Webb; R. Marshall Stowell; Mark T. Winslow; Avishai Kepten; Norman D. Kaplan; Richard K. Lyons; John B. Alexy


Archive | 2012

Plating cup with contoured cup bottom

Zhian He; Jingbin Feng; Shantinath Ghongadi; Frederick Dean Wilmot


Archive | 2012

Lipseals and contact elements for semiconductor electroplating apparatuses

Jingbin Feng; Marshall Stowell; Frederick D. Wilmot


Archive | 2010

FRONT REFERENCED ANODE

Jingbin Feng; R. Marshall Stowell; Shantinath Ghongadi; Zhian He; Frederick Dean Wilmot

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