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Featured researches published by Joachim Dutzi.


Micro-Optical Technologies for Measurement, Sensors, and Microsystems | 1996

Assembly and interconnection technologies for electrical and optical microsystems

Roland Mueller-Fiedler; Joachim Dutzi; Eberhard Moess; K. Kuettner; Nils Kummer; Michael Dipl Phys Gundlach

Silicon micromachining, thin-film-multilayer-technology, integrated optical circuits and micro-optics were combined to realize optoelectronic microsystems. The potential of silica based inorganic waveguide materials and optical polymers were investigated and compared with respect to their process compatibility and their ability for integration with electronic, optoelectronic and micromechanical functions. An integrated optical modulator, an optical 2 by 2-switch and a micro-optical receiver were realized as test devices. The results reveal advantages of polymeric materials with respect to the optical functions of modulating or switching of light on the basis of thermo- optical phase shifting. However, the integration of the various process steps into a complete microsystem could only be accomplished with silica based optical circuits.


Archive | 1997

Transition from a waveguide to a strip transmission line

Ewald Schmidt; Klaus Voigtländer; Hermann Mayer; Bernhard Lucas; Gerd Dennerlein; Thomas Beez; Roland Müller; Herbert Olbrich; Siegbert Martin; Joachim Dutzi; John Bird; David Dawson; Colin Nash; Brian Prime; Cyril Edward Pettit


Archive | 1998

Electronic component housing, e.g. for a Gunn diode of a distance radar for an automobile adaptive cruise control system, comprises a cover with an integral contact spring for electrically contacting the component

Manfred Leiter; Kurt Weiblen; Bernhard Lucas; Frank Schatz; Thomas Beez; Juergen Seiz; Helmut Baumann; Herbert Olbrich; Heinz Eisenschmid; Eberhard Moess; Joachim Dutzi; Andreas Kugler


Archive | 2001

Arrangement for producing electrical oscillations

Manfred Leiter; Kurt Weiblen; Berhard Lucas; Frank Schatz; Thomas Beez; Juergen Seiz; Helmeut Baumann; Herbert Olbrich; Heinz Eisenschmid; Eberhard Moess; Joachim Dutzi; Andreas Kugler


Archive | 1999

Housing for electronic component, and method of producing the same

Manfred Leiter; Kurt Weiblen; Bernhard Lucas; Frank Schatz; Thomas Beez; Juergen Seiz; Helmut Baumann; Herbert Olbrich; Heinz Eisenschmid; Eberhard Moess; Joachim Dutzi; Andreas Kugler


Archive | 2002

Substrate with a smoothed surface and method of manufacturing thereof

Klaus Voigtlaender; Roland Mueller-Fiedler; Thomas Walter; Oliver Roesch; Joachim Dutzi


Archive | 1998

Verfahren zur Eingehäusung elektronischer Bauelemente Method for Eingehäusung electronic components

Helmut Baumann; Thomas Beez; Joachim Dutzi; Heinz Eisenschmid; Andreas Kugler; Manfred Leiter; Bernhard Lucas; Gilbert Moersch; Eberhard Moess; Herbert Olbrich; Frank Schatz; Juergen Seiz; Kurt Weiblen


Archive | 1998

A method for electronic components Eingehäusung

Helmut Baumann; Thomas Beez; Joachim Dutzi; Heinz Eisenschmid; Andreas Kugler; Manfred Leiter; Bernhard Lucas; Gilbert Moersch; Eberhard Moess; Herbert Olbrich; Frank Schatz; Juergen Seiz; Kurt Weiblen


Archive | 1997

Method of forming an oxide layer not wettable by solder

Joachim Dutzi; Heinz Hauer; Albrecht Kuke


Archive | 1997

Verfahren zur Herstellung von Lothöckern definierter Größe A process for producing solder bumps defined size

Heiner Hauer; Albrecht Kuke; Joachim Dutzi

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