Johannes Kowalewski

Method for production of contacts on a wafer

Producing hard mask for semiconductor structure involves providing structured mask layer on hard mask layer, ion implantation, removing structured layer, structuring hard mask layer by selectively etching non-implanted or implanted region

Producing contact holes in integrated circuit involves using optical lithography with mask with elongated, slit-shaped openings for producing essentially circular and/or elongated holes

Method for producing a mask adapted to an exposure apparatus

Method for producing a mask adapted to a lighting device

Reducing illumination device imaging errors involves determining auxiliary structures acting on working structure diffraction spectrum with dimensions less than optical resolution limit by simulation

A process for preparing a customized to an exposure device mask

Verfahren zur Herstellung von Kontakten auf einem Wafer

Mark configuration, wafer with at least one mark configuration, and a method of producing at least one mark configuration

Verfahren zur Herstellung von Kontakten auf einem Wafer A process for the production of contacts on a wafer