Jonathan B. Smith | Researchain

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Featured researches published by Jonathan B. Smith.

Archive | 2000

Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices

Larry Zhao; Paul R. Besser; Eric M. Apelgren; Christian Zistl; Jonathan B. Smith

Archive | 2000

Dielectric formation to seal porosity of low dielectic constant (low k) materials after etch

Paul R. Besser; Spikantewara Dakshina-murthy; Jeremy I. Martin; Jonathan B. Smith; Eric M. Apelgren

Archive | 2002

Resist trim process to define small openings in dielectric layers

Srikanteswara Dakshina-Murthy; Paul R. Besser; Jonathan B. Smith; Eric M. Apelgren; Christian Zistl; Jeremy I. Martin; Lie Larry Zhao; Nicholas J. Kepler

Archive | 1998

Method of exhaust control for spin-on films with reduced defects

Jonathan B. Smith; C. Bradford Hopper

Archive | 2000

Dielectric formation to seal porosity of etched low dielectric constant materials

Paul R. Besser; Dakshina-Murthy Srikantewara; Jeremy I. Martin; Jonathan B. Smith; Eric M. Apelgren

Archive | 2006

METAL ALLOY LAYER OVER CONDUCTIVE REGION OF TRANSISTOR DEVICE OF DIFFERENT CONDUCTIVE MATERIAL THAN CONDUCTIVE REGION

Judith M. Rubino; James Pan; Dinkar Singh; Jonathan B. Smith; Anna W. Topol

Archive | 2001

Sidewall treatment for low dielectric constant (low K) materials by ion implantation

Jeremy I. Martin; Eric M. Apelgren; Christian Zistl; Paul R. Besser; Srikantewara Dakshina-Murthy; Jonathan B. Smith; Nick Kepler; Fred T K Cheung

Archive | 2000

Photoresist removal using a polishing tool

Eric M. Apelgren; Jonathan B. Smith; Paul R. Besser

Archive | 2000

Dual slurry particle sizes for reducing microscratching of wafers

Jonathan B. Smith; Paul R. Besser; Jeremy I. Martin

Archive | 2000

Method of defining small openings in dielectric layers

Srikanteswara Dakshina-Murthy; Paul R. Besser; Jonathan B. Smith; Eric M. Apelgren; Christian Zistl; Jeremy I. Martin; Lie Larry Zhao; Nicholas J. Kepler

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