Christian Zistl | Researchain

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Publication

Featured researches published by Christian Zistl.

Archive | 2000

Reverse electroplating of barrier metal layer to improve electromigration performance in copper interconnect devices

Larry Zhao; Paul R. Besser; Eric M. Apelgren; Christian Zistl; Jonathan B. Smith

Archive | 2002

Diffusion barrier layer in semiconductor substrates to reduce copper contamination from the back side

Christian Zistl; Johannes Groschopf; Massud Aminpur

Archive | 2002

Resist trim process to define small openings in dielectric layers

Srikanteswara Dakshina-Murthy; Paul R. Besser; Jonathan B. Smith; Eric M. Apelgren; Christian Zistl; Jeremy I. Martin; Lie Larry Zhao; Nicholas J. Kepler

Archive | 2001

Locally increasing sidewall density by ion implantation

Eric M. Apelgren; Christian Zistl; Jeremy I. Martin; Paul R. Besser; Fred T K Cheung

Archive | 2000

Method of forming a semiconductor device with metal silicide regions

Paul R. Besser; Christian Zistl; Nicholas J. Kepler

Archive | 2005

Method of patterning a low-k dielectric using a hard mask

Matthias Lehr; Peter Huebler; Christian Zistl

Archive | 2003

Simultaneous formation of device and backside contacts on wafers having a buried insulator layer

Massud Aminpur; Gert Burbach; Christian Zistl

Archive | 2000

Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist

Ting Yiu Tsui; Stephen Keetai Park; Christian Zistl

Archive | 2001

Sidewall treatment for low dielectric constant (low K) materials by ion implantation

Jeremy I. Martin; Eric M. Apelgren; Christian Zistl; Paul R. Besser; Srikantewara Dakshina-Murthy; Jonathan B. Smith; Nick Kepler; Fred T K Cheung

Archive | 2000

Method of defining small openings in dielectric layers

Srikanteswara Dakshina-Murthy; Paul R. Besser; Jonathan B. Smith; Eric M. Apelgren; Christian Zistl; Jeremy I. Martin; Lie Larry Zhao; Nicholas J. Kepler

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