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DeokKyung Yang

STATS ChipPAC Ltd

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Publication

Featured researches published by DeokKyung Yang.

Archive | 2008

Semiconductor package system with through silicon via interposer

Daesik Choi; DeokKyung Yang; Seung Won Kim

Archive | 2008

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

A Leam Choi; Jae Han Chung; DeokKyung Yang; Hyungsang Park

Archive | 2009

Integrated circuit packaging system with stackable package and method of manufacture thereof

DeokKyung Yang; Daesik Choi

Archive | 2008

Integrated circuit package system with step mold recess

In Sang Yoon; HanGil Shin; Jae Han Chung; DeokKyung Yang

Archive | 2011

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF

A Leam Choi; DeokKyung Yang; JoHyun Bae

Archive | 2010

Semiconductor packaging system with an aligned interconnect and method of manufacture thereof

In Sang Yoon; JoHyun Bae; DeokKyung Yang

Archive | 2008

Integrated circuit package-on-package system with central bond wires

DeokKyung Yang; Jae Han Chung; Hyun Joung Kim

Archive | 2008

Integrated circuit with step molded inner stacking module package in package system

DeokKyung Yang; In Sang Yoon; Jae Han Chung

Archive | 2008

Integrated circuit package system having cavity

Jong-Woo Ha; Daesik Choi; DeokKyung Yang

Archive | 2010

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED CONDUCTOR AND METHOD OF MANUFACTURE THEREOF

DeokKyung Yang; SeungYun Ahn

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Collaboration

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In Sang Yoon

STATS ChipPAC Ltd

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Daesik Choi

STATS ChipPAC Ltd

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Jae Han Chung

STATS ChipPAC Ltd

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A Leam Choi

STATS ChipPAC Ltd

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JoHyun Bae

STATS ChipPAC Ltd

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Jong-Woo Ha

STATS ChipPAC Ltd

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Seung Won Kim

STATS ChipPAC Ltd

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Sungmin Song

STATS ChipPAC Ltd

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Byoung Wook Jang

STATS ChipPAC Ltd

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HanGil Shin

STATS ChipPAC Ltd

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