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Dive into the research topics where Joseph D. Luttmer is active.

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Featured researches published by Joseph D. Luttmer.


Journal of Electronic Materials | 1995

Piezoelectric effects in HgCdTe devices

C. F. Wan; Joseph D. Luttmer; R. S. List; R. L. Strong

Piezoelectric effect in long-wavelength infrared (LWIR) HgCdTe has been studied using metal-insulator-semiconductor (MIS) and p-n homojunction devices. A cantilever beam technique was used to measure the shift in flatband voltage in the MIS devices as a function of applied strain, from which piezoelectric constant was derived. This is the first time such a value has been reported in the literature. Subsequent calculation showed that the thermal stress from cryogenic cool (from 300 to 77K) of hybridized infrared devices fabricated on (111) HgCdTe surfaces induced a piezoelectric field of∼1840 V/cm. This field is present in the space charge regions in the semiconductor where there is no free carrier. It reinforces the built-field in an n-on-p diode fabricated on the (111)A HgCdTe surface. Thus, the diode is more prone to the thermal stress than one fabricated on the (lll)B surface. Electrical measurement of reverse-bias dark currents in HgCdTe photodiodes under applied compressive and tensile stress confirmed the existence of a strain-induced field in the junction.


Archive | 1991

Method for dry etching openings in integrated circuit layers

Jerome L. Elkind; Patricia B. Smith; Larry D. Hutchins; Joseph D. Luttmer; Rudy L. York; Julie S. England


Archive | 1988

Wafer processing apparatus having independently controllable energy sources

Cecil J. Davis; Rhett B. Jucha; Joseph D. Luttmer; Rudy L. York; Lee M. Loewenstein; Robert T. Matthews; Randall C. Hildenbrand


Archive | 1988

Method of sequential cleaning and passivating a GaAs substrate using remote oxygen plasma

Rudy L. York; Joseph D. Luttmer; Patricia B. Smith; Cecil J. Davis


Archive | 1992

Processing method using both a remotely generated plasma and an in-situ plasma with UV irradiation

Cecil J. Davis; Rhett B. Jucha; Joseph D. Luttmer; Rudy L. York; Lee M. Loewenstein; Robert T. Matthews; Randall C. Hildenbrand


Archive | 1988

Method for deposition of silicon oxide on a wafer

Dean W. Freeman; Joseph D. Luttmer; Patricia B. Smith; Cecil J. Davis


Archive | 1983

Photovoltaic solar arrays using silicon microparticles

Kent Randall Carson; Joseph D. Luttmer; Charles E. Williams; William R. McKee; Stephen T. Tso; Elwin L. Johnson


Archive | 1999

Method of forming integrated circuit dielectric by evaporating solvent to yield phase separation

Changming Jin; Joseph D. Luttmer


Journal of Electronic Materials | 2002

Analysis of copper grains in Damascene trenches after rapid thermal processing of furnace anneals

Qing-Tang Jiang; Matt Nowell; Brendan Foran; Aaron Frank; R. H. Havemann; Vijay Parihar; R. A. Augur; Joseph D. Luttmer


Archive | 1992

Method for forming an infrared detector having a refractory metal

Rudy L. York; Joseph D. Luttmer; Chang F. Wan; Thomas W. Orent; Larry D. Hutchins; Art Simmons

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