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international electronics manufacturing technology symposium | 1998

Development of fine pitch ball grid array

Jun Shibata; Manabu Horita; Naoki Izumi; Taketoshi Shikano; Makio Okada; Yoshie Noguchi; Kenji Imamura; Hideki Fukunaga; Masatoshi Yasunaga; Tatsuya Hirai; Tomoaki Hashimoto; Yoshitaka Takemoto

A fine pitch ball grid array (FBGA) has been developed which is suitable mainly for logic devices such as micro control units (MCU) and application specific integrated circuits (ASIC) for consumer portable electronic instruments. The FBGA has a construction in which a die is attached to a glass-epoxy interposer with a single layer conductor. Wire bonding and transfer molding are applied in the same manner as lead frame type packages. The FBGA has a smaller body and higher performance than conventional packages. The package structure, assembly process, performance and reliability test results are introduced.


Archive | 1995

Substrateless resin encapsulated semiconductor device

Shinji Baba; Jun Shibata; Tetsuya Ueda


Archive | 1994

Plastic molded semiconductor package

Akiyoshi Sawai; Haruo Shimamoto; Toru Tachikawa; Jun Shibata


Archive | 2001

Resin-sealed chip stack type semiconductor device

Takashi Kondo; Koji Bando; Jun Shibata; Kazuko Narutaki


Archive | 1997

Plastic molded semiconductor package and method of manufacturing the same

Akiyoshi Sawai; Haruo Shimamoto; Toru Tachikawa; Jun Shibata


Archive | 2001

DUAL PACKAGE SEMICONDUCTOR DEVICE

Hideki Ishii; Kazunari Michii; Jun Shibata; Moriyoshi Nakashima


Archive | 1996

Semiconductor device with tape automated bonding element

Yomiyuki Yama; Masao Kobayashi; Jun Shibata; Shinji Baba; Masaki Watanabe


Archive | 1992

Semiconductor device having particular power distribution interconnection arrangement

Haruo Shimamoto; Jun Shibata; Toru Tachikawa; Tetsuya Ueda; Hiroshi Seki


Archive | 2000

Resin-sealed bga type semiconductor device

Koji Bando; Takashi Kondo; Kazuko Narutaki; Jun Shibata; 晃司 板東; 潤 柴田; 隆 近藤; 和子 鳴瀧


Archive | 1996

Package for semiconductor device laminated printed circuit boards

Masaki Watanabe; Akiyoshi Sawai; Yoshikazu Narutaki; Tomoaki Hashimoto; Masatoshi Yasunaga; Jun Shibata; Hiroshi Seki; Kazuhiko Kurafuchi; Katsunori Asai

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