K. Kosai

High performance HgCdTe two-color infrared detectors grown by molecular beam epitaxy

High-performance in situ doped two-color detectors with the n-p-n architecture for the sequential detection of mid: and long-wave infrared radiation were grown by molecular beam epitaxy. These detector structures were twin-free, and exhibited narrow rocking curves ( 45 arcsec) as determined by X-ray measurements. The near surface etch pit densities in these device structures were typically (2-3) x 10 6 cm -2 . The structures were processed as mesas and their electrical properties measured. The spectral response of the mid-wave and long-wave diodes in the integrated detector were characterized by sharp turn-on and turn-off in both bands. Average R o A values of 100 Ω cm 2 at 10.5 μm and 5.5 x 10 5 Ω cm 2 at 5.5 μm were measured at 77 K. These results are comparable to those of the best unispectral detectors and represents a significant milestone for MBE-grown HgCdTe two-color devices

Integrated two-color detection for advanced focal plane array (FPA) applications

Integrated two-color detector arrays offer significant system advantages (over separate arrays for each color) where two-color information is required. Using a single array with co-located spectral band sensitivities guarantees perfect pixel registration between the two different spectral band images. These two-color IR detectors can be made in HgCdTe using a pair of back-to-back-diodes incorporated in a triple-layer heterojunction (TLHJ). Use of HgCdTe allows any combination of bands between SWIR and LWIR. TLHJs can be operated in either a sequential or simultaneous mode by leaving the layer common to the two diodes floating or by contacting it. The effect of the choice of spectral bands on the meaning of sequential and simultaneous operation is discussed. State-of-the-art trend line performance for each spectral band of a TLHJ has been demonstrated using an all-LPE HgCdTe technology at SBRC. Mean MWIR RrA of 2 X 107 (Omega) -cm2 and LWIR of 1.6 X 103 (Omega) -cm2 have been shown. Quantum efficiencies are typical of trend line PV HgCdTe. Very high quality imaging has been demonstrated using 64 X 64 sensor chip assemblies in a sequential mode incorporating the above TLHJs. Simultaneous detectors have been made in miniarrays and test structures of various size unit cells. 128 X 128 simultaneous arrays are under study. Imaging and test results (performance and uniformity) for each band are comparable to state-of-the-art single-color HgCdTe arrays.

Mbe growth of HgCdTe avalanche photodiode structures for low-noise 1.55 μm photodetection

Molecular-beam epitaxy (MBE) has been utilized to fabricate HgCdTe heterostructure separate absorption and multiplication avalanche photodiodes (SAM-APD) sensitive to infrared radiation in the 1.1-1.6 μm spectral range, as an alternative technology to existing III-V APD detectors. Device structures were grown on CdZnTe(211)B substrates using CdTe, Te, and Hg sources with in situ In and As doping. The composition of the HgCdTe alloy layers was adjusted to achieve both efficient absorption of IR radiation in the 1.1-1.6 μm spectral range and low excess-noise avalanche multiplication. The Hg 1-x Cd x Te alloy composition in the gain region of the device, = 0.73, was selected to achieve equality between the bandgap energy and spin-orbit splitting to resonantly enhance the impact ionization of holes in the split-off valence band. The appropriate value of this alloy composition was determined from analysis of the 300 K bandgap and spin-orbit splitting energies of a set of calibration layers, using a combination of IR transmission and spectroscopic ellipsometry measurements. MBE-grown APD epitaxial wafers were processed into passivated mesa-type discrete device structures and diode mini-arrays using conventional HgCdTe process technology. Device spectral response, dark current density, and avalanche gain measurements were performed on the processed wafers. Avalanche gains in the range of 30-40 at reverse bias of 85-90 V and array-median dark current density below 2 x 10 -4 A/cm 2 at 40 V reverse bias have been demonstrated.

Molecular beam epitaxial growth and performance of integrated multispectral HgCdTe photodiodes for the detection of mid-wave infrared radiation

In situ doped HgCdTe two-color detectors with the n-p-n geometry were grown by molecular beam epitaxy, for the simultaneous detection of two closely spaced bands in the mid-wave infrared spectrum. The average near-surface etch pit densities in these layers were 5 x10 6 cm -2 , which is a factor of 10 higher than that observed for the lattice-matched growth of Hg 1-x Cd x Te (x =0.22) layer on Cd 0.96 Zn 0.04 Te substrates. The 0.04% lattice mismatch between the Hg 1-x Cd x Te (x = 0.35) epilayer and the Cd 0.9 Zn 0.04 Te substrate produces plastic deformation of the epilayer which results in an increased dislocation densities in the epilayer. The alloy composition across the device structure along the growth direction was determined by secondary ion mass spectrometric analysis, and deviated by less than 1% from the target. The device structures were processed as diodes with the mesa architecture and tested. The spectral response of the detectors at 77 K was characterized by sharp turn off at 3.7 and 4.4 μm. R 0 A values in excess of 1 x 10 6 Ω cm 2 and quantum efficiencies greater than 75% were measured for diodes in each band.

Molecular beam epitaxial growth of HgCdTe midwave infrared multispectral detectors

Molecular beam epitaxy (MBE) has been utilized to fabricate high performance HgCdTe infrared detectors with sensitivity to midwave infrared radiation in adjacent spectral bands for two-color thermal imaging applications. Growth of a multilayer HgCdTe device structure by MBE enables the use of an n-p-n device architecture that facilitates pixel-level registration of images in two separate spectral bands. Device structures were grown on CdZnTe(211)(B) substrates using CdTe, Te, and Hg sources with in situ In and As doping. The composition of the HgCdTe alloy layers was adjusted to achieve detection of infrared radiation in adjacent spectral bands in the 3.5–4.5 μm wavelength range. As-grown device structures were characterized with x-ray diffraction, wet chemical defect etching, and secondary ion mass spectrometry. Mesa type devices were patterned using reactive ion etching and ohmic contacts were made to the two n-type layers for operation of the detectors in a sequential detection mode. The spectral respo...

Advances in linear and area HgCdTe APD arrays for eyesafe LADAR sensors

HgCdTe APDs and APD arrays offer unique advantages for high-performance eyesafe LADAR sensors. These include: operation at room temperature, low-excess noise, high gain, high-quantum efficiency at eyesafe wavelengths, GHz bandwidth, and high-packing density. The utility of these benefits for systems are being demonstrated for both linear and area array sensors. Raytheon has fabricated 32 element linear APD arrays utilizing liquid phase epitaxy (LPE), and packaged and integrating these arrays with low-noise amplifiers. Typical better APDs configured as 50-micron square pixels and fabricated utilizing RIE, have demonstrated high fill factors, low crosstalk, excellent uniformity, low dark currents, and noise equivalent power (NEP) from 1-2 nW. Two units have been delivered to NVESD, assembled with range extraction electronics, and integrated into the CELRAP laser radar system. Tests on these sensors in July and October 2000 have demonstrated excellent functionality, detection of 1-cm wires, and range imaging. Work is presently underway under DARPAs 3-D imaging Sensor Program to extend this excellent performance to area arrays. High-density arrays have been fabricated using LPE and molecular beam epitaxy (MBE). HgCdTe APD arrays have been made in 5 X 5, 10 X 10 and larger formats. Initial data shows excellent typical better APD performance with unmultiplied dark current < 10 nA; and NEP < 2.0 nW at a gain of 10.

Epitaxial growth of HgCdTe 1.55-μm avalanche photodiodes by molecular beam epitaxy

Separate absorption and multiplication avalanche photodiode (SAM-APD) device structures, operating in the 1.1 - 1.6 micrometer spectral range, have been fabricated in the HgCdTe material system by molecular-beam epitaxy. These HgCdTe device structures, which offer an alternative technology to existing III-V APD detectors, were grown on CdZnTe(211)B substrates using CdTe, Te, and Hg sources with in situ In and As doping. The alloy composition of the HgCdTe layers was adjusted to achieve both efficient absorption of IR radiation in the 1.1 - 1.6 micrometer spectral range and low excess-noise avalanche multiplication. To achieve resonant enhancement of hole impact ionization from the split-off valence band, the Hg1-xCdxTe alloy composition in the gain region of the device, x equals 0.73, was chosen to achieve equality between the bandgap energy and spin-orbit splitting. The appropriate value of this alloy composition was determined from analysis of the 300 K bandgap and spin-orbit splitting energies of a set of calibration layers, using a combination of IR transmission and spectroscopic ellipsometry measurements. MBE-grown APD epitaxial wafers were processed into passivated mesa-type discrete device structures and diode mini-arrays using conventional HgCdTe process technology. Device spectral response, dark current density, and avalanche gain measurements were performed on discrete diodes and diode mini- arrays on the processed wafers. Avalanche gains in the range of 30 - 40 at reverse bias of 85 - 90 V and array-median dark current density below 2 X 10-4 A/cm2 at 40 V reverse bias have been demonstrated.

Advances in HgCdTe-based infrared detector materials: the role of molecular-beam epitaxy

Since its initial synthesis and investigation more than 40 years ago, the HgCdTe alloy semiconductor system has evolved into one of the primary infrared detector materials for high-performance infrared focal-plane arrays (FPA) designed to operate in the 3-5 mm and 8-12 mm spectral ranges of importance for thermal imaging systems. Over the course of the past decade, significant advances have been made in the development of thin-film epitaxial growth techniques, such as molecular-beam epitaxy (MBE), which have enabled the synthesis of IR detector device structures with complex doping and composition profiles. The central role played by in situ sensors for monitoring and control of the MBE growth process are reviewed. The development of MBE HgCdTe growth technology is discussed in three particular device applications: avalanche photodiodes for 1.55 +m photodetection, megapixel FPAs on Si substrates, and multispectral IR detectors.