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Kenji Iketaki

Fujitsu

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Publication

Featured researches published by Kenji Iketaki.

Archive | 2001

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

Masayuki Kitajima; Yutaka Noda; Seiichi Shimoura; Toru Okada; Masanao Fujii; Kenji Iketaki; Hidehiko Kobayashi; Masakazu Takesue; Keiichi Yamamoto; Hisao Tanaka

Archive | 1994

MOUNTING STRUCTURE OF PACKAGE

Kenji Iketaki; Toru Okada; Naoki Yamazaki; 直樹 山崎; 徹 岡田; 憲治 池滝

Archive | 1995

Soldering appts. for mounting components on printed circuit boards

Toru Okada; Kenji Iketaki; Naoki Yamazaki

Archive | 2001

Method of assembling micro-actuator

Toru Okada; Kenji Iketaki; Hidehiko Kobayashi; Yutaka Noda; Masayuki Kitajima; Seiichi Shimoura; Masakazu Takesue; Keiichi Yamamoto; Hisao Tanaka; Masanao Fujii

Archive | 2000

Mounting method for package

Kenji Iketaki; Toru Okada; Naoki Yamazaki; 直樹 山崎; 徹 岡田; 憲治 池滝

Archive | 2007

Reflowing apparatus and reflowing method

Kenji Iketaki

Archive | 2002

Leiterplattenanordnung und Verfahren zu deren Herstellung Printed circuit board assembly and process for their preparation

Shunichi Kikuchi; Mitsutaka Yamada; Kenji Iketaki

Archive | 2002

Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device

Shunichi Kikuchi; Mitsutaka Yamada; Kenji Iketaki

Archive | 2002

Circuit board assembly and process for their preparation

Shunichi Kikuchi; Mitsutaka Yamada; Kenji Iketaki

Archive | 2001

BOARD UNIT EQUIPPED WITH HEAT ABSORBING DUMMY COMPONENT, AND METHOD FOR MANUFACTURING THE SAME

Kenji Iketaki; Shunichi Kikuchi; Mitsutaka Yamada; 光隆 山田; 憲治 池滝; 俊一 菊池

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Collaboration

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Toru Okada

Fujitsu

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Hidehiko Kobayashi

Fujitsu

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Hisao Tanaka

Fujitsu

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Naoki Yamazaki

Fujitsu

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Seiichi Shimoura

Fujitsu

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Keiichi Yamamoto

Fujitsu

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Masakazu Takesue

Fujitsu

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Masanao Fujii

Fujitsu

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Masayuki Kitajima

Fujitsu

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Yutaka Noda

Fujitsu

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