Ki Jin Han

Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions

For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.

Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections

For the design of high-density 3-D integration, this paper presents a method to model through-silicon via (TSV) interconnections. Focusing on the modeling of annular insulator coating around the TSV, this paper proposes a new type of modal basis functions that describe polarization current density distribution in insulator. The equivalent network including modal excess capacitance from the basis functions provides accurate electrical characteristics, compared with analytic and EM simulation results.

Eye-Pattern Design for High-Speed Differential Links Using Extended Passive Equalization

The performance of current high-speed consumer electronic systems is often compromised by degradation caused by distortion in eye patterns. This paper proposes a systematic method that uses the voltage transfer function for arbitrary source and load terminations to improve the eye patterns of high-speed differential links with passive components that minimize distortion. This approach is cost-effective since it only utilizes commercially available surface-mount components. The methodology has been validated by measurements in this paper.

Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBFs. Examples of several 3D interconnects verify that the proposed method is efficient in speed and memory.

Wideband electrical modeling of large three-dimensional interconnects using accelerated generation of partial impedances with cylindrical conduction mode basis functions

For wideband modeling of large and complicated three-dimensional interconnects, this paper proposes an efficiency improvement in solving electric field integral equation with cylindrical conduction mode basis functions. Based on the multifunction method, the improved method reduces computational cost by using smaller number of higher-order basis functions for computing mutual inductances between far-separated conductors. From the modeling examples of through-hole vias and bonding wires in stacked IC’s, the proposed method is verified for application to real three-dimensional interconnects.

Cylindrical Conduction Mode Basis Functions for Modeling of Inductive Couplings in System-in-Package (SiP)

PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in system-in-package. Combination of a few basis functions accurately describes high-frequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.

Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions

To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.

Parasitic extraction of interconnections in 3-D packaging using mixed potential integral equation with global basis functions

This paper presented an efficient method to extract the interconnection parasitic elements in 3-D packaging. The use of the MPIE with the global basis functions enables automatic generation of the equivalent circuit, complexity of which can be controlled by the defined model bandwidth. The proposed method is well applied several interconnection examples, and can be extended to modeling practical problems containing large number of interconnections.

Eye-Pattern Improvement for Design of High-Speed Differential Links Using Passive Equalization

A systematic method to improve eye-patterns of high-speed differential links by using passive components is proposed in this paper. A channel model without source termination is considered and a passive network is included to fit a desirable transfer function. Simulation results in both time and frequency domains are shown for validity of the proposed method

Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.