Madhavan Swaminathan | Researchain

Archive Network Publication Hotspot Collaboration

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Madhavan Swaminathan is active.

Explore More

Publication

Featured researches published by Madhavan Swaminathan.

Archive | 2006

Package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof

Madhavan Swaminathan; Ege Engin; Prathap Muthana; Krishna Srinivasan

Archive | 2006

Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof

Madhavan Swaminathan; Ege Engin; Lixi Wan; Prathap Muthana

Archive | 2010

Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications

Prathap Muthana; Ege Engin; P. M. Raj; Madhavan Swaminathan; Rao Tummala; Venkatesh Sundaram; Daniel Irwin Amey; Karl Hartmann Dietz; Sounak Banerji; Moises Cases

Proc. Progress In Electromagnetics Research Symposium | 2006

Modeling of EBG Structures Using the Transmission Matrix Method

Krishna Bharath; Ege Engin; Toyota Yoshitaka; Madhavan Swaminathan

Annual Symposium on Microelectronics | 2005

Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid-Frequency Range

Prathap Muthana; Ege Engin; Madhavan Swaminathan; Rao Tummala; Venkatesh Sundaram; Lixi Wan; Swapan K. Bhattacharya; P. M. Raj; Kang J. Lee; Mahesh Varadarajan; I.R. Abothu

Archive | 2006

Package having array of embedded capacitors for power transfer and decoupling of high-speed input/output circuit, and method of manufacturing same

Engin Ege; Prathap Muthana; Krishna Srinivasan; Madhavan Swaminathan; エンジンエーゲ; スリニバサンクリシュナ; ムサナプラタプ; スワミナサンマダバン

Archive | 2006

IC-package having an array of embedded capacitors for low noise power delivery and for decoupling in the mid-frequency range of 1MHz to 3GHz. Methods of forming the IC-package.

Madhavan Swaminathan; Lixi Wan; Ege Engin; Prathap Muthana

International Symposium on Microelectronics | 2013

RF Device Integration on Glass Interposer toward 3D-IPAC Packages

Yoichiro Sato; Bruce Chou; Vijay Sukumaran; Junki Min; Motoshi Ono; Choukri Karoui; Franck Dosseul; Christian Nopper; Madhavan Swaminathan; Venky Sundaram; Rao Tummala

Archive | 2010