Madhavan Swaminathan

Package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof

Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof

Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications

Modeling of EBG Structures Using the Transmission Matrix Method

Measurement, Modeling and Characterization of Embedded Capacitors for Power Delivery in the Mid-Frequency Range

Package having array of embedded capacitors for power transfer and decoupling of high-speed input/output circuit, and method of manufacturing same

IC-package having an array of embedded capacitors for low noise power delivery and for decoupling in the mid-frequency range of 1MHz to 3GHz. Methods of forming the IC-package.

RF Device Integration on Glass Interposer toward 3D-IPAC Packages

パワーインテグリティのすべて : クラシックモダン・実践エレクトロニクス : 電源ノイズを抑えるプリント基板設計

A device for providing low noise power supply package to IC