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Ki Youn Jang

STATS ChipPAC Ltd

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Publication

Featured researches published by Ki Youn Jang.

Archive | 2010

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Ki Youn Jang; YoungJoon Kim; JoHyun Bae

Archive | 2006

BUMP FOR OVERHANG DEVICE

Hun Teak Lee; Jong Kook Kim; Chulsik Kim; Ki Youn Jang; Keon Teak Kang; Hyung Jun Jeon

Archive | 2012

Electronic system with expansion feature

Haengcheol Choi; Ki Youn Jang; Taewoo Kang; Il Kwon Shim

Archive | 2006

Method of fabricating a shielded stacked integrated circuit package system

Ki Youn Jang; Youngmin Kim; Hyung Jun Jeon

Archive | 2007

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PASSIVE COMPONENTS

Ki Youn Jang

Archive | 2005

Semiconductor system with fine pitch lead fingers

Hun Teak Lee; Jong Kook Kim; Chulsik Kim; Ki Youn Jang

Archive | 2008

Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof

YoungJoon Kim; Ki Youn Jang

Archive | 2006

Epoxy bump for overhang die

Hun Teak Lee; Jong Kook Kim; Chul Sik Kim; Ki Youn Jang

Archive | 2006

Integrated circuit underfill package system

Hyung Jun Jeon; Ki Youn Jang; DaeWook Yang

Archive | 2009

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Ki Youn Jang; Youngmin Kim; Hyung Jun Jeon

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Collaboration

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Hun Teak Lee

STATS ChipPAC Ltd

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Hyung Jun Jeon

STATS ChipPAC Ltd

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Jong Kook Kim

STATS ChipPAC Ltd

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Chulsik Kim

STATS ChipPAC Ltd

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Youngmin Kim

STATS ChipPAC Ltd

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JoHyun Bae

STATS ChipPAC Ltd

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YoungJoon Kim

STATS ChipPAC Ltd

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Chul Sik Kim

STATS ChipPAC Ltd

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DaeWook Yang

STATS ChipPAC Ltd

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Haengcheol Choi

STATS ChipPAC Ltd

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