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JoHyun Bae

STATS ChipPAC Ltd

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Publication

Featured researches published by JoHyun Bae.

Archive | 2011

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF

Daesik Choi; JoHyun Bae; Junghoon Shin

Archive | 2010

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Ki Youn Jang; YoungJoon Kim; JoHyun Bae

Archive | 2007

Mountable integrated circuit package system with stacking interposer

In Sang Yoon; JoHyun Bae; HanGil Shin

Archive | 2007

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE

Sungmin Song; SeungYun Ahn; JoHyun Bae; Jong-Woo Ha

Archive | 2006

Mountable integrated circuit package-in-package system with adhesive spacing structures

Jong-Woo Ha; Seongmin Lee; JoHyun Bae

Archive | 2007

Integrated circuit package system with dual side connection

Sungmin Song; SeungYun Ahn; JoHyun Bae

Archive | 2009

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF

SeungYun Ahn; JoHyun Bae; Sangjin Lee

Archive | 2006

Integrated circuit package system employing mold flash prevention technology

Ki Youn Jang; Sungmin Song; JoHyun Bae

Archive | 2011

Integrated circuit package system with dual side connection and method for manufacturing thereof

Sungmin Song; SeungYun Ahn; JoHyun Bae

Archive | 2011

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF

A Leam Choi; DeokKyung Yang; JoHyun Bae

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Collaboration

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Daesik Choi

STATS ChipPAC Ltd

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In Sang Yoon

STATS ChipPAC Ltd

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SeungYun Ahn

STATS ChipPAC Ltd

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Seongmin Lee

STATS ChipPAC Ltd

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Sungmin Song

STATS ChipPAC Ltd

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Jong-Woo Ha

STATS ChipPAC Ltd

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DeokKyung Yang

STATS ChipPAC Ltd

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Ki Youn Jang

STATS ChipPAC Ltd

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SungWon Cho

STATS ChipPAC Ltd

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A Leam Choi

STATS ChipPAC Ltd

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