JoHyun Bae

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with stacked lead and method of manufacture thereof

Mountable integrated circuit package system with stacking interposer

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE

Mountable integrated circuit package-in-package system with adhesive spacing structures

Integrated circuit package system with dual side connection

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit package system employing mold flash prevention technology

Integrated circuit package system with dual side connection and method for manufacturing thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF