Kim H. Chen

Multi-chip packaging for high performance systems

Multichip module (MCM) substrate, component assembly, and cooling technologies have been developed and demonstrated on several vehicles that include a 4-Kbyte RAM module operating at above 100-MHz clock frequency. An optimum MCM may consist of a set of composite layers of a multi-layer thin film polyimide structure over a multilayer ceramic substrate with a high pin density. The MCM technology provides system designers with increased circuit packing density and a larger number of accessible circuits, which results in lower machine-cycle time and cycles per instruction, leading to higher system performance. Moreover, the MCM technology opens up options for circuit organization and system architecture and for further improvements in system performance.<<ETX>>