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Kimihito Nishikawa

MITSUBISHI MATERIALS CORPORATION

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Publication

Featured researches published by Kimihito Nishikawa.

Archive | 2013

Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, and paste for bonding copper member

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa; Yoshirou Kuromitsu

Archive | 2013

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa; Yoshirou Kuromitsu

Archive | 2014

MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE

Tomoya Oohiraki; Sotaro Oi; Kimihito Nishikawa; Hiromasa Hayashi

Archive | 2013

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa

Archive | 2013

SOLDER JOINT STRUCTURE, POWER MODULE, POWER MODULE SUBSTRATE WITH HEAT SINK AND METHOD OF MANUFACTURING THE SAME, AND PASTE FOR FORMING SOLDER BASE LAYER

Shuji Nishimoto; Kimihito Nishikawa; Yoshiyuki Nagatomo

Archive | 2013

Solder joint structure, power module, heat-sink-attached substrate for power module, method for producing said substrate, and paste for forming solder underlayer

Shuji Nishimoto; Kimihito Nishikawa; Yoshiyuki Nagatomo

Archive | 2017

JOINED BODY MANUFACTURING METHOD, MULTILAYER JOINED BODY MANUFACTURING METHOD, POWER-MODULE SUBSTRATE MANUFACTURING METHOD, HEAT SINK EQUIPPED POWER-MODULE SUBSTRATE MANUFACTURING METHOD, AND LAMINATED BODY MANUFACTURING DEVICE

Tomoya Oohiraki; Sotaro Oi; Kimihito Nishikawa

Archive | 2013

はんだ接合構造、パワーモジュール、ヒートシンク付パワーモジュール用基板及びそれらの製造方法、並びにはんだ下地層形成用ペースト

Shuji Nishimoto; 修司 西元; Kimihito Nishikawa; 仁人 西川; Yoshiyuki Nagatomo; 長友 義幸

Archive | 2013

Lötverbindungsstruktur, leistungsmodul, an einem kühlkörper befestigtes substrat für ein leistungsmodul, verfahren zur herstellung dieses substrats und paste zur herstellung einer lötunterschicht

Shuji Nishimoto; Kimihito Nishikawa; Yoshiyuki Nagatomo

Archive | 2013

Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa

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Yoshiyuki Nagatomo

MITSUBISHI MATERIALS CORPORATION

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Shuji Nishimoto

MITSUBISHI MATERIALS CORPORATION

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Nobuyuki Terasaki

MITSUBISHI MATERIALS CORPORATION

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Shuuji Nishimoto

MITSUBISHI MATERIALS CORPORATION

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Takeshi Kitahara

MITSUBISHI MATERIALS CORPORATION

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Toshiyuki Nagase

MITSUBISHI MATERIALS CORPORATION

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Sotaro Oi

MITSUBISHI MATERIALS CORPORATION

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Tomoya Oohiraki

MITSUBISHI MATERIALS CORPORATION

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Yoshirou Kuromitsu

MITSUBISHI MATERIALS CORPORATION

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Hiromasa Hayashi

MITSUBISHI MATERIALS CORPORATION

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