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ieee multi chip module conference | 1994

High performance MCM-D technology

Shunichi Kikuchi; Haruhiko Yamamoto; Kiyotaka Seyama; Minoru Hirano; Kiyokazu Moriizumi

FUJITSU has developed an MCM-D technology which uses bare chips on composite thin films for mounting CMOS chips with high density and low cost. The first use of this technology is for the K6000 Series business server. This MCM technology can be applied to a wide range of computers, from workstations to mainframes to reduce costs and improve performance. This paper focuses on the MCM packaging technology, MCM substrate technology, cooling technology and numerical analysis technique.<<ETX>>


Archive | 2004

Method for making a front and back conductive substrate

Kiyokazu Moriizumi


Archive | 2000

Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip

Kiyokazu Moriizumi; Satoshi Osawa


Archive | 2001

Front-and-back electrically conductive substrate and method for manufacturing same

Kiyokazu Moriizumi


Archive | 2000

High density thin film circuit board and method of production thereof

Kiyokazu Moriizumi; Mikio Nishihara


Archive | 1995

MULTILAYER THIN-FILM WIRING BOARD

Kiyokazu Moriizumi; Kiyotaka Seyama


Archive | 2001

Front-and-back electrically conductive substrate

Kiyokazu Moriizumi


Archive | 1997

Thin-film multi-layer substrate and electronic device

Kiyokazu Moriizumi; Shunichi Kikuchi; Kazuhiro Nitta; Naomi Fukunaga; Mitsuo Suehiro


Archive | 1989

Module sealing structure

Kiyokazu Moriizumi; Kyoichiro Kawano; Kiyotaka Seyama


Archive | 2004

Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times

Kiyokazu Moriizumi; Manabu Watanabe

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