Klaus-Günter Oppermann

Method for producing a protective cover for a device

Apparatus for housing a micromechanical structure and method for producing the same

Method for generating a protective cover for a device

Apparatus for housing a micromechanical structure

Resin cover application to a system wafer, comprises applying a cover to a carrier via a connection layer, and then mechanically removing the carrier and connection layer

Micromechanical component and process for its fabrication

Sacrificial layer removal method for semiconductor technology using microchannels formed in structured layer for transporting removal medium to sacrificial layer

Vorrichtung zur Häusung einer mikromechanischen Struktur und Verfahren zur Herstellung derselben

Method for forming protective cover for electronic component, e.g. acoustic wave filter, resonator, sensor and/or actuator, involves depositing second layer onto first cover layer and forming aperture in second cover layer

Method for fabricating integrated sensors