Koichi Nagao
Panasonic
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Koichi Nagao.
international electronics manufacturing technology symposium | 1994
Koichi Nagao; Kazunari Nishihara; Hiroaki Fujimoto; Kenzo Hatada
A new solderless connection technology using light-setting insulation resin has been developed. This makes possible fine-pitch and short length connection between the FPC (Flexible Printed Circuit) and the electrodes of an electronic device. An FPC is attached by the adhesive force of the light-setting insulation resin. This technology has been applied to a thin-film magnetic head, and realized ultra fine connection, i.e. a connection pitch of 75 /spl mu/m (present ratio 1/2) and a connection length of 250 /spl mu/m (present ratio 1/10).<<ETX>>
Archive | 2002
Koichi Nagao; Hiroaki Fujimoto
Archive | 1995
Koichi Nagao; Yoshiro Nakada; Shinichi Oki; 義朗 中田; 伸一 沖; 浩一 長尾
Archive | 2004
Koichi Nagao
Archive | 1996
Koichi Nagao; Yoshiro Nakata; Shinichi Oki
Archive | 1996
Shinichi Oki; Koichi Nagao; Yoshiro Nakata
Archive | 1986
Kenzo Hatada; Koichi Nagao
Archive | 1996
Yoshiro Nakata; Shinichi Oki; Koichi Nagao; Kenzo Hatada; Shigeoki Mori; Takashi Sato; Kunio Sano
Archive | 1983
Kenzo Hatada; Shigeoki Mori; Koichi Nagao; Yoshiro Nakada; Shinichi Oki; Kunio Sano; Takashi Sato; 義朗 中田; 尚 佐藤; 國夫 佐野; 薫興 森; 伸一 沖; 賢造 畑田; 浩一 長尾
Archive | 2002
Hiroaki Fujimoto; Koichi Nagao; 博昭 藤本; 浩一 長尾
