Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Kun-bin Lee is active.

Publication


Featured researches published by Kun-bin Lee.


international solid-state circuits conference | 2015

18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format smartphone applications

Chi-cheng Ju; Tsu-Ming Liu; Kun-bin Lee; Yung-Chang Chang; Han-Liang Chou; Chin-Ming Wang; Tung-Hsing Wu; Hue-Min Lin; Yi-Hsin Huang; Chia-Yun Cheng; Ting-An Lin; Chun-Chia Chen; Yu-Kun Lin; Min-Hao Chiu; Wei-Cing Li; Sheng-Jen Wang; Yen-Chieh Lai; Ping Chao; Chih-Da Chien; Meng-Jye Hu; Peng-Hao Wang; Fu-Chun Yeh; Yen-Chao Huang; Shun-Hsiang Chuang; Lien-Fei Chen; Hsiu-Yi Lin; Ming-Long Wu; Che-Hong Chen; Ryan Chen; Heng-Shou Hsu

A 4K×2K H.265/HEVC video codec chip is fabricated in a 28nm CMOS process with a core area of 2.16mm2. This LSI chip integrates a dual-standard (H.265 and H.264) video codec and a series of prevalent (VC-1, WMV-7/8/9, VP-6/8, AVS, RM-8/9/10, MPEG-2/4) decoders into a single chip. It contains 3,558K logic gates and 308KB of internal SRAM. Moreover, it simplifies intra/inter-rate-distortion optimization (RDO) processes and reduces external bandwidth via line-store SRAM pool (LSSP) and data-bus translation (DBT) techniques. For smartphone applications, it completes real-time HEVC encoding and decoding with 4096×2160 resolution and 30fps, and consumes 126.73mW (0.5nJ/pixel) of core power dissipation at 0.9V, at 494MHz (encoding) and 350MHz (decoding). 1080HD and 720HD resolutions are reported as well. The chip features are summarized in Fig. 18.6.1.


IEEE Journal of Solid-state Circuits | 2016

A 0.5 nJ/Pixel 4 K H.265/HEVC Codec LSI for Multi-Format Smartphone Applications

Chi-cheng Ju; Tsu-Ming Liu; Kun-bin Lee; Yung-Chang Chang; Han-Liang Chou; Chih-Ming Wang; Tung-Hsing Wu; Hue-Min Lin; Yi-Hsin Huang; Chia-Yun Cheng; Ting-An Lin; Chun-Chia Chen; Yu-Kun Lin; Min-Hao Chiu; Wei-Cing Li; Sheng-Jen Wang; Yen-Chieh Lai; Ping Chao; Chih-Da Chien; Meng-Jye Hu; Peng-Hao Wang; Yen-Chao Huang; Shun-Hsiang Chuang; Lien-Fei Chen; Hsiu-Yi Lin; Ming-Long Wu; Che-Hong Chen

A 4 K × 2 K H.265/HEVC video codec chip supporting 14 video standard formats is implemented on a 1.49 × 1.45 mm 2 die in a 28 nm CMOS process. Several HEVC fast algorithms reduce the coding modes by analyzing the content features leading to over 68.5% and 83% of complexity reduction in intra and inter coding, respectively. A fully parallel processing element (PE) array is adopted in SAO and IP/ME, which reduce number of accesses to SRAM by 48.7% and 78.4%, respectively. A shared memory management unit (MMU) including line-store SRAM pool (LSSP) and data bus translation (DBT) techniques efficiently reuses and packs the neighboring pixels which contribute 71.6% of external bandwidth reduction. This chip achieves 4096 × 2160@30 fps HEVC encoding/decoding and consumes 126.73 mW, 0.5 nJ/pixel of energy efficiency, under 494 MHz and 350 MHz of clock frequency, enabling 4 K video services for smart-phone applications.


asian solid state circuits conference | 2012

A 1.94mm 2 , 38.17mW dual VP8/H.264 Full-HD encoder/decoder LSI for Social Network Services (SNS) over smart-phones

Chi-cheng Ju; Tsu-Ming Liu; Yi-Hau Chen; Kun-bin Lee; Chia-Yun Cheng; Hsueh-Te Chao; Chih-Ming Wang; Tung-Hsing Wu; Tin-An Lin; Han-Liang Chou; Yu-Kun Lin; Cheng-Hung Liu; Wei-Cing Li; Yi-Hsin Huang; Tsung-Chuan Ma; Chun-Chia Chen; Hue-Min Lin; Min-Hao Chiu; Sheng-Jen Wang; Yung-Chang Chang; Chung-Hung Tsai

A first dual-standard video encoder and decoder LSI providing VP8 (i.e. video format of WebM project for use of webs video) or H.264/AVC video recording and playback simultaneously is implemented with 28nm CMOS and occupies 1.94mm2 of core area. Several area-efficient techniques are realized, leading to 43.6% of area reduction. A new rate control is designed to facilitate the adaptation of video data and frame rates for network services. Two fast algorithms and new bool encoder/decoder are proposed to enhance power efficiency. This chip consumes 28.15mW and 10.02mW of VP8 encoder and decoder average power for 1080p@30fps at 0.9V, respectively.


Archive | 2010

Method of storing motion vector information and video decoding apparatus

Yung-Chang Chang; Chih-Ming Wang; Kun-bin Lee


Archive | 2013

METHOD AND APPARATUS FOR PROCESSING VIDEO STREAM

Kun-bin Lee; Chi-cheng Ju; Yung-Chang Chang; Chih-Ming Wang


Archive | 2012

METHOD AND APPARATUS FOR LOOP FILTERING

Kun-bin Lee; Yi-Hau Chen; Chi-cheng Ju; Yu-Wen Huang; Shaw-Min Lei; Chih-Ming Fu; Ching-Yeh Chen; Chia-Yang Tsai; Chih-Wei Hsu


Archive | 2014

METHOD AND APPARATUS USING SOFTWARE ENGINE AND HARDWARE ENGINE COLLABORATED WITH EACH OTHER TO ACHIEVE HYBRID VIDEO ENCODING

Kun-bin Lee; Cheng-Hung Liu; Han-Liang Chou; Chi-cheng Ju


Archive | 2013

METHOD AND APPARATUS FOR PERFORMING LOSSY IMAGE COMPRESSION THROUGH SOURCE QUANTIZATION AND LOSSLESS COMPRESSION KERNEL, AND RELATED METHOD AND APPARATUS FOR IMAGE DECOMPRESSION

Tung-Hsing Wu; Han-Liang Chou; Kun-bin Lee; Chi-cheng Ju


Archive | 2013

Image compression method and apparatus for encoding pixel data of frame into interleaved bit-stream, and related image decompression method and apparatus

Tung-Hsing Wu; Kun-bin Lee; Han-Liang Chou; Ting-An Lin; Chi-cheng Ju


Archive | 2015

Method and Apparatus of Transform Process for Video Coding

Tung-Hsing Wu; Kun-bin Lee; Yi-Hsin Huang

Collaboration


Dive into the Kun-bin Lee's collaboration.

Researchain Logo
Decentralizing Knowledge