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Kun-Dae Yeom

Samsung

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Publication

Featured researches published by Kun-Dae Yeom.

Archive | 2011

Stack type semiconductor package and method of fabricating the same

Young-shin Choi; Young-Lyong Kim; Kun-Dae Yeom

Archive | 2004

Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same

Kun-Dae Yeom

Archive | 2010

Semiconductor package, stack module, card, and electronic system

Keun-ho Choi; Myung-Kee Chung; Kun-Dae Yeom; Kil-Soo Kim

Archive | 2012

SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF SEGMENTS

Kun-Dae Yeom; Young-Min Kim; Jong-Bo Shim; Woo-dong Lee

Archive | 2011

HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME

Yun-rae Cho; Kun-Dae Yeom

Archive | 2005

Package having dummy package substrate and method of fabricating the same

Young-Min Lee; Kun-Dae Yeom

Archive | 2014

Semiconductor package including multiple chips and separate groups of leads

Chul Park; Hysong-seob Kim; Kun-Dae Yeom; Gwang-Man Lim

Archive | 2007

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

Young-Lyong Kim; Young-shin Choi; Jong-gi Lee; Kun-Dae Yeom; Eun-Chul Ahn

Archive | 2011

LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE BETWEEN A LAND AND A SOLDER RESIST

Heechul Lee; Myung-Kee Chung; Kun-Dae Yeom

Archive | 2008

Semiconductor package and apparatus using the same

Kun-Dae Yeom; Sang-Wook Park; Sung-Ki Lee

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Collaboration

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Jong-gi Lee

Samsung

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Sang-Wook Park

Samsung

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Young-Lyong Kim

Samsung

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Young-shin Choi

Samsung

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Dong-hun Lee

Samsung

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Hyung-Gil Baek

Samsung

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Myung-Kee Chung

Samsung

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Sung-Ki Lee

Samsung

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Chul Park

Samsung

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Chul-Yong Jang

Samsung

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