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Featured researches published by Hyung-Gil Baek.


international conference on thermal mechanial and multi physics simulation and experiments in micro electronics and micro systems | 2007

Development of Reliability Verification System for Robust Package Design

Dong-Kil Shin; Hyung-Gil Baek; Dong-Ok Kwak; Ku-young Kim; Young-hee Song; Jeong-Yeol Kim

To achieve design for reliability (DFR), a reliability verification system (RVS) was developed. Package level and board level reliabilities were predicted by the developed system automatically and the design for six sigma (DFSS) was achieved. Process server and database server were developed. FEM mesh was generated automatically by well-organized builder, simulation conditions were assigned by standardized procedure, and reliabilities were calculated by developed life models. All data related to the simulation were managed by database system. High quality simulation was carried out easily and quickly. Robust package design was achieved by design optimization using the RVS.


Archive | 2008

Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same

Hyung-Gil Baek


Archive | 2006

Integrated circuit package and integrated circuit module

Sang-Wook Park; Joong-hyun Baek; Hyung-Gil Baek


Archive | 2006

Stack package implementing conductive support

Hyung-Gil Baek


Archive | 2006

Stack package of ball grid array type

Sang-Wook Park; Hyung-Gil Baek


Archive | 2012

ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF

Jae Choon Kim; Jichul Kim; Hyung-Gil Baek; Eunseok Cho


Archive | 2010

MULTI-CHIP PACKAGES INCLUDING EXTRA MEMORY CHIPS TO DEFINE ADDITIONAL LOGICAL PACKAGES AND RELATED DEVICES

Hyung-Gil Baek


Archive | 2006

Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package

Hyung-Gil Baek; Sang-Wook Park; Joong-hyun Baek


Archive | 2011

STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Dong-hun Lee; Hyung-Gil Baek; Kun-Dae Yeom


Archive | 2008

Semiconductor packages including thermal stress buffers and methods of manufacturing the same

Ku-young Kim; Hyung-Gil Baek; Jong-gi Lee; Sang-Wook Park; Kun-Dae Yeom; Dong-hun Lee

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