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Kunio Kishida

Mitsubishi

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Publication

Featured researches published by Kunio Kishida.

Archive | 1984

Copper alloy having high resistance to oxidation for use in leads on semiconductor devices

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida

Archive | 1983

Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida

Archive | 1992

SPUTTERING TARGET AND MANUFACTURE THEREFOR

Toshinori Ishii; Makoto Kinoshita; Kunio Kishida; Masaki Morikawa; 邦雄 岸田; 真 木下; 正樹 森川; 利昇 石井

Archive | 1983

CU-ALLOY FOR SLIDE MEMBER

Takuro Iwamura; Kunio Kishida

Archive | 1981

Cu-Ag base alloy brazing filler material

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida; Chuji Tanaka

Archive | 1981

Cu-Ag-Si Base alloy brazing filler material

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida; Chuji Tanaka

Archive | 1978

White copper alloy for architecture and decorative technical art

Tetsuji Hasegawa; Kunio Kishida; Masaki Morikawa; Isao Takeuchi; Koichi Tanaka

Archive | 1976

Cu alloy for base material of composite electric contact

Takuro Iwamura; Kunio Kishida; Masaki Morikawa; Isao Takeuchi

Archive | 1983

Kupferlegierung mit hoher oxidationsbestaendigkeit, die sich fuer leiter in halbleitervorrichtungen eignet, und diese legierung enthaltendes verbundmaterial Copper alloy with high oxidation resistance, for the ladder is in semiconductor devices, and this alloy containing composite material

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida

Archive | 1983

Copper alloy with high oxidation resistance, the conductor for suitable in semiconductor devices, and this alloy containing composite material

Masaki Morikawa; Hideaki Yoshida; Kunio Kishida

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Masaki Morikawa

Mitsubishi

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Hideaki Yoshida

Mitsubishi

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Chuji Tanaka

Mitsubishi

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Makoto Kinoshita

MITSUBISHI MATERIALS CORPORATION

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Toshinori Ishii

MITSUBISHI MATERIALS CORPORATION

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