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Kurokawa Shuhei

Kyushu University

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Publication

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Journal of The Japan Society for Precision Engineering | 2007

Trend of Semiconductor Devices and Planarization Technology with Future Development( Planarization Technology of Semiconductor Device)

土肥 俊郎; Doi Toshiro; Hiyama Hirokuni; 檜山 浩国; Fukuda Akira; 福田 明; Kurokawa Shuhei; 黒河 周平

Archive | 2017

LASER PROCESSING METHOD, MANUFACTURING METHOD FOR MATERIAL TO BE PROCESSED, LASER CLEANING METHOD, LASER PROCESSING DEVICE, AND LASER CLEANING DEVICE

Hayashi Terutake; Kurokawa Shuhei

IEICE Technical Report; IEICE Tech. Rep. | 2017

Plasma fusion CMP® technology for GaN substrates -- Evaluation of processing characteristics for plasma fusion CMP® using Ar plasma and ethanol bubbling

Yamazaki Naoki; Doi Toshiro; Aida Hideo; Kim Seongwoo; Oyama Koki; Kurokawa Shuhei; Sano Yasuhisa; Shiratani Masaharu; Yamanishi Yoko

精密工学会九州支部地方講演会講演論文集 | 2016

フェムト秒レーザを用いたダブルパルスビームによる励起状態面の表面加工に関する研究(第三報)―間接遷移半導体の加工領域と励起電子密度の関係―

Yokoo Hideaki; Hayashi Terutake; Kurokawa Shuhei; Matsunaga Keigo; Matsukawa Yoji

Archive | 2015

METHOD OF ESTIMATING THIN FILM FOR ORGANIC EL ELEMENT AND THIN FILM FORMING APPARATUS FOR ORGANIC EL ELEMENT

Kato Mikihiro; Miyaji Keiji; Seike Yoshiyuki; Murata Masami; Kurokawa Shuhei

Archive | 2013

METHOD FOR INSPECTING RECESS OF AND RESIST FILM OF SUBSTRATE

Doi Toshiro; Kurokawa Shuhei; Onishi Osamu; Otsubo Masanori; Miyaji Keiji; Seike Yoshiyuki; Shimai Futoshi; Maruyama Kenji; Sato Masahiko

Archive | 2011

Polishing solution for silicon carbide and polishing method employing the solution

Doi Toshiro; Kurokawa Shuhei; Ohnishi Osamu; Hasegawa Tadashi; Kawase Yasuhiro; Yamaguchi Yasuhide

The Proceedings of Conference of Kyushu Branch | 2010

316 Cu-CMP process by controlled atmosphere polishing machine with carbon dioxide

大木 洋太; Oki Yota; 土肥 俊郎; Doi Toshiro; Kurokawa Shuhei; 黒河 周平; 梅崎 洋二; Umezaki Yoji; 松川 洋二; Matsukawa Yoji; 北村 圭; Kitamura Kei; Koshiyama Isamu; 越山 勇

Journal of The Japan Society for Precision Engineering | 2009

Development of Abrasive-Free Copper CMP Process : - Reduction of Copper Residue Using Randomly Formed Polyurethane Pad -

Yamada Yohei; 山田 洋平; 小西 信博; Konishi Nobuhiro; Kurokawa Shuhei; 黒河 周平; Doi Toshiro; 土肥 俊郎

Journal of The Japan Society for Precision Engineering | 2008

Study on Reduction of Micro-Scratch in Oxide CMP for Multi-Level Interconnection : Investigation of Mechanism for Micro-Scratch Formation in CMP Process

山田 洋平; Yamada Yohei; 菅谷 貴浩; Sugaya Takahiro; 小西 信博; Konishi Nobuhiro; 黒河 周平; Kurokawa Shuhei; 土肥 俊郎; Doi Toshiro

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Collaboration

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Doi Toshiro

Kyushu University

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黒河 周平

Kyushu University

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土肥 俊郎

Kyushu University

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Umezaki Yoji

Kyushu University

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梅崎 洋二

Kyushu University

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Ijima Yuho

Kyushu University

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Matsukawa Yoji

Kyushu University

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井島 有朋

Kyushu University

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Hasegawa Tadashi

Kyushu University

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Kitamura Kei

Kyushu University

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