Kurt W. Berger

Diffraction-limited soft-x-ray projection imaging using a laser plasma source

Projection imaging of 0.1-microm lines and spaces is demonstrated with a Mo/Si multilayer coated Schwarzschild objective and 14-nm illumination from a laser plasma source. This structure has been etched into a silicon wafer by using a trilevel resist and reactive ion etching. Low-contrast modulation at 0.05-microm lines and spaces is observed in polymethylmethacrylate.

Prototype high-speed tape target transport for a laser plasma soft-x-ray projection lithography source

A prototype high-speed tape target transport is constructed for use in a high-repetition-rate laser plasma source. To reduce plasma debris, a 1000-5000-A-thick film of target material is supported by thin Mylar tape backing. Tape is transported to the laser focal volume at a maximum velocity of 356 cm/s, a rate sufficient to accommodate laser repetition rates of 1 kHz. The transport is fully vacuum compatible and can be retracted and then isolated from the laser plasma vacuum enclosure during tape reel replacement. The operating characteristics of the transport are described.

Diffraction‐limited soft x‐ray projection lithography with a laser plasma source

A laser plasma source of extreme ultraviolet and soft x‐ray radiation has been used to print diffraction‐limited features using soft x‐ray projection lithography. A spherical condenser optic, a Si/Ge transmissive mask and a Mo/Si multilayer‐coated Schwarzschild objective having 20:1 reduction ratio were employed to pattern selected single‐layer and trilevel resists. At a numerical aperture of 0.12, a 0.1‐μm line and space pattern is clearly delineated and weak modulation is observed for the analogous 0.05‐μm pattern.

Sub-100-nm lithographic imaging with an EUV 10x microstepper

The capabilities of the EUV 10x microstepper have been substantially improved over the past year. The key enhancement was the development of a new projection optics system with reduced wavefront error, reduced flare, and increased numerical aperture. These optics and concomitant developments in EUV reticles and photoresists have enabled dramatic improvements in EUV imaging, illustrated by resolution of 70 nm dense lines and spaces (L/S). CD linearity has been demonstrated for dense L/S over the range 100 nm to 80 nm, both for the imaging layer and for subsequent pattern transfer. For a +/- 10 percent CD specification, we have demonstrated a process latitude of +/- micrometers depth of focus and 10 percent dose range for dense 100 nm L/S.

Initial results from the EUV engineering test stand

The Engineering Test Stand (ETS) is an EUV lithography tool designed to demonstrate full-field EUV imaging and provide data required to accelerate production-tool development. Early lithographic results and progress on continuing functional upgrades are presented and discussed. In the ETS a source of 13.4 nm radiation is provided by a laser plasma source in which a Nd:YAG laser beam is focused onto a xenon- cluster target. A condenser system, comprised of multilayer-coated and grazing incidence mirrors, collects the EUV radiation and directs it onto a reflecting reticle. The resulting EUV illumination at the reticle and pupil has been measured and meets requirements for acquisition of first images. Tool setup experiments have been completed using a developmental projection system with (lambda) /14 wavefront error (WFE), while the assembly and alignment of the final projection system with (lambda) /24 WFE progresses in parallel. These experiments included identification of best focus at the central field point and characterization of imaging performance in static imaging mode. A small amount of astigmatism was observed and corrected in situ, as is routinely done in advanced optical lithographic tools. Pitch and roll corrections were made to achieve focus throughout the arc-shaped field of view. Scan parameters were identified by printing dense features with varying amounts of magnification and skew correction. Through-focus scanned imaging results, showing 100 nm isolated and dense features, will be presented. Phase 2 implementation goals for the ETS will also be discussed.

Soft-x-ray projection lithography experiments using Schwarzschild imaging optics

Soft-x-ray projection imaging is demonstrated by the use of 14-nm radiation from a laser plasma source and a single-surface multilayer-coated ellipsoidal condenser. Aberrations in the condenser and the Schwarzschild imaging objective are characterized and correlated with imaging performance. A new Schwarzschild housing, designed for improved alignment stability, is described.

Characterization of chemically amplified resists for soft x‐ray projection lithography

Sensitivity, lithographic performance, photoabsorption, and photodesorption of chemically amplified novolac‐based resists have been studied at an exposure wavelength of 140 A and are compared to poly(methylmethacrylate) (PMMA). Monochromatic exposures of the resists AZ PF514, AZ PN114, and SAL 601 yielded D0.9 values of 2.5–3 mJ/cm2 for 0.25 μm thick films. Contrast values ranged from 3 for AZ PN114 to 5 for SAL 601. Photoabsorption measurements of supported AZ PN114 films at 140 A yield an absorption coefficient of 4.4±0.1 μm−1. Photodesorption of fragment ions induced by 140 A radiation has been studied in PMMA and AZ PN114 using time‐of‐flight mass spectrometry. It is found that H+, CH2+, CH3+, H2O+, CHO+, C3H5+, and COOCH3+ dominate the ion mass spectra photodesorbed from PMMA, while H+, CH3+, H2O+, and CHO+ dominate the ion mass spectra for AZ PN114. The mass‐integrated ion desorption yield from AZ PN114 is three times less than that measured for PMMA per photon or 90 times less when expressed per ex...

Recent advances in the Sandia EUV 10x microstepper

The Sandia EUV 10x microstepper system is the result of an evolutionary development process, starting with a simple 20x system, progressing through an earlier 10x system, to the current system that has full microstepper capabilities. The 10x microstepper prints 400-micrometers -diameter fields at sub- 0.10-micrometers resolution. Upgrades include the replacement of the copper wire target with a pulsed xenon jet target, construction of an improved projection optics system, the addition of a dose monitor a d an aerial image monitor, and the addition of a graphical user interface to the system operation software. This paper provides an up-to-date report on the status of the microstepper.

Development of a laboratory extreme-ultraviolet lithography tool

The development of a laboratory EUV lithography tool based on a laser plasma source, a 10x Schwarzschild camera, and a magnetically levitated wafer stage is presented. Interferometric measurements of the camera aberrations are incorporated into physical-optics simulations to estimate the EUV imaging performance of the camera. Experimental results demonstrate the successful matching of five multilayer reflecting surfaces, coated to specification for a wide range of figure and incidence angle requirements. High-resolution, 10x-reduction images of a reflection mask are shown.

Fabrication of metal–oxide–semiconductor devices with extreme ultraviolet lithography

This article reports results from the successful fabrication of metal–oxide–semiconductor (MOS) devices with extreme ultraviolet lithography. n‐type MOS transistors with gate lengths of 0.1 μm were fabricated and demonstrated good device characteristics. The alignment strategy, mask layout, mask fabrication, and device characteristics will be reported.