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Kuo Hung-Jui

TSMC

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Publication

Featured researches published by Kuo Hung-Jui.

Archive | 2014

Semiconductor device and method for fabricating the same, packaged semiconductor device

Lei Yi-Yang; Yeh Szu-Yu; Chen Yu-Ren; Kuo Hung-Jui; Liu Chung-Shi

Archive | 2018

METHOD OF MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE

Hu Yu-Hsiang; Chen Wei-Yu; Kuo Hung-Jui; Lin Wei-Hung; Cheng Ming-Da; Liu Chung-Shi

Archive | 2017

Redistribution circuit structure

Lee Tzung-Hui; Kuo Hung-Jui; Ho Ming-Che; Huang Tzu-Yun

Archive | 2017

Packagestrukturen und Verfahren zu deren Bildung

Hu Yu-Hsiang; Liu Chung-Shi; Kuo Hung-Jui; Liao Sih-Hao

Archive | 2017

INTEGRATED FAN-OUT PACKAGE

Liao Sih-Hao; Kuo Hung-Jui; Hu Yu-Hsiang

Archive | 2017

Bondstrukturen und Verfahren zu ihrer Herstellung

Lii Mirng-Ji; Liu Chung-Shi; Ku Chin-Yu; Kuo Hung-Jui; Kalnitsky Alexander; Ho Ming-Che; Wu Yi-Wen; Chen Ching-Hui

Archive | 2017

HALBLEITERVORRICHTUNG UND VERFAHREN

Liu Zi-Jheng; Hu Yu-Hsiang; Lan Jo-Lin; Liao Sih-Hao; Kuo Chen-Cheng; Kuo Hung-Jui; Liu Chung-Shi; Yu Chen-Hua; Chou Meng-Wei

Archive | 2016

Package with under ball metallization (UBM) and methods of forming

Yu Chen-Hua; Li Chien-Yu; Kuo Hung-Jui; Huang Li-Hsien; Chen Hsien-Wei; Yeh Der-Chyang; Liu Chung-Shi; Jeng Shin-Puu

Archive | 2016

Gehäuse mit UBM und Verfahren zum Bilden

Yu Chen-Hua; Li Chien-Yu; Kuo Hung-Jui; Huang Li-Hsien; Chen Hsien-Wei; Yeh Der-Chyang; Liu Chung-Shi; Jeng Shin-Puu

Archive | 2015

Gestaffelte Via-Umverdrahtungsschicht (RDL) für ein Paket

Liu Chung-Shi; Yu Chen-Hua; Kuo Hung-Jui

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Collaboration

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Liu Chung-Shi

TSMC

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Yu Chen-Hua

TSMC

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Hu Yu-Hsiang

TSMC

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Liao Sih-Hao

TSMC

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Chen Hsien-Wei

TSMC

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Chen Yu-Ren

TSMC

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Huang Li-Hsien

TSMC

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Jeng Shin-Puu

TSMC

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Lei Yi-Yang

TSMC

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Li Chien-Yu

TSMC

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