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Dive into the research topics where Louis N. Hutter is active.

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Featured researches published by Louis N. Hutter.


international symposium on power semiconductor devices and ic s | 2001

LeadFrameOnChip offers integrated power bus and bond over active circuit

Taylor R. Efland; D. Abbott; V. Arellano; Milton L. Buschbom; W. Chang; C. Hoffart; Louis N. Hutter; Quang Mai; I. Nishimura; Sameer Pendharkar; M. Pierce; C.C. Shen; C.M. Thee; H. Vanhorn; C. Williams

A metal system consisting of thick electroplated copper leads having a top plating of nickel and palladium cap are integrated on top of power ICs to form a bondable LeadFrameOnChip surface.


applied power electronics conference | 1992

A 2.0 micron BiCMOS process including DMOS transistors for merged linear ASIC analog/digital/power applications

John P. Erdeljac; B. Todd; Louis N. Hutter; K. Wagensohner; W. Bucksch

A 2.0 mu m BiCMOS process incorporating 30 V bipolar, 5-50 V CMOS, precision analog elements, and 45 V power DMOS transistors with 2.0 m Omega cm/sup 2/ R/sub DSON/ area is presented. The process is compatible with a mature mixed-signal application-specific integrated circuit (ASIC) cell library and offers fully isolated CMOS devices, providing an effective solution for intelligent analog/digital/power applications with inductive loads. This technology has been applied to the design of a 2.5 A H-bridge with supporting logic and analog control circuitry.<<ETX>>


international symposium on power semiconductor devices and ic's | 1997

A dual-slot power-interface switch for PCMCIA controllers using a novel bi-directional switching concept, built in a 1 /spl mu/m BiCMOS/DMOS power process

Marco Corsi; John P. Erdeljac; Louis N. Hutter; J. Sanders

PCMCIA cards are used to add a variety of features to portable computers-modems, LANs, GPS, etc. Some means of switching power to the inserted PCMCIA card is required: this paper describes the design and process technology for a second-generation, single-chip, dual-slot PCMCIA power interface switch.


bipolar/bicmos circuits and technology meeting | 1995

A 1.0 /spl mu/m linear BiCMOS technology with power DMOS capability

Erich Bayer; Walter Bucksch; Kevin Scoones; Konrad Wagensohner; J. Erdeljac; Louis N. Hutter

A 1.0 micron BiCMOS process, with lateral DMOS as an available process extension, is presented for mixed-signal and power applications, providing a broad range of active and passive components. The DMOS transistor offers 45-60 V capability with Rsp=1.25 m/spl Omega/.cm/sup 2/. The process has been used to build a 5A H-Bridge for automotive applications, the design of which is described in detail.


midwest symposium on circuits and systems | 1992

Analog BiCMOS technology

Louis N. Hutter; Jeffrey P. Smith; James Dogan Goon

Design issues associated with developing an analog BiCMOS process technology are reviewed. This information is then highlighted with an example of BiCMOS process stressing modularity and component diversity. Future technology issues for next-generation processes are discussed.<<ETX>>


Archive | 2002

Integrated circuit with bonding layer over active circuitry

Taylor R. Efland; Donald C. Abbott; Walter Bucksch; Marco Corsi; Chi-Cheong Shen; John P. Erdeljac; Louis N. Hutter; Quang X. Mai; Konrad Wagensohner; Charles E. Williams; Milton L. Buschbom


Archive | 1987

Merged bipolar/CMOS technology using electrically active trench

Louis N. Hutter


Archive | 1998

LDMOS power device with oversized dwell

Chin-Yu Tsai; Taylor R. Efland; Sameer Pendharkar; John P. Erdeljac; Jozef Mitros; Jeffrey P. Smith; Louis N. Hutter


Archive | 1998

Metallization outside protective overcoat for improved capacitors and inductors

John P. Erdeljac; Louis N. Hutter; M. Ali Khatibzadeh; John K. Arch


Archive | 1988

Deep trench isolation with surface contact to substrate

Louis N. Hutter; James Dogan Goon; Shiu-Hang Yan; Gopal K. Rao

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