Lu Shen
Agency for Science, Technology and Research
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Publication
Featured researches published by Lu Shen.
Radiation Effects and Defects in Solids | 2015
Ali Hussnain; R. S. Rawat; R. Ahmad; Tousif Hussain; Z. A. Umar; Uzma Ikhlaq; Zhong Chen; Lu Shen
Nano-crystalline tungsten nitride thin films are synthesized on AISI-304 steel at room temperature using Mather-type plasma focus system. The surface properties of the exposed substrate against different deposition shots are examined for crystal structure, surface morphology and mechanical properties using X-ray diffraction (XRD), atomic force microscope, field emission scanning electron microscope and nano-indenter. The XRD results show the growth of WN and WN2 phases and the development of strain/stress in the deposited films by varying the number of deposition shots. Morphology of deposited films shows the significant change in the surface structure with different ion energy doses (number of deposition shots). Due to the effect of different ion energy doses, the strain/stress developed in the deposited film leads to an improvement of hardness of deposited films.
Chinese Physics B | 2014
Z.A. Umar; R. S. Rawat; R. Ahmad; Aditya Kumar; Yiqian Wang; Tousif Hussain; Zhong Chen; Lu Shen; Z. Zhang
The Al/a-C nanocomposite thin films are synthesized on Si substrates using a dense plasma focus device with aluminum fitted anode and operating with CH4/Ar admixture. X-ray diffractometer results confirm the formation of metallic crystalline Al phases using different numbers of focus shots. Raman analyses show the formation of D and G peaks for all thin film samples, confirming the presence of a-C in the nanocomposite thin films. The formation of Al/a-C nanocomposite thin films is further confirmed using X-ray photoelectron spectroscopy analysis. The scanning electron microscope results show that the deposited thin films consist of nanoparticles and their agglomerates. The sizes of th agglomerates increase with increasing numbers of focus deposition shots. The nanoindentation results show the variations in hardness and elastic modulus values of nanocomposite thin film with increasing the number of focus shots. Maximum values of hardness and elastic modulus of the composite thin film prepared using 20 focus shots are found to be about 10.7 GPa and 189.2 GPa, respectively.
Journal of Vacuum Science & Technology B | 2005
Y.C. Ee; Zhong Chen; Lap Chan; K. H. See; S. B. Law; S. Xu; Zviad Tsakadze; P. P. Rutkevych; K.Y. Zeng; Lu Shen
Titanium silicon nitride (Ti–Si–N) has emerged as a strong candidate for next generation diffusion barrier material in copper/low-k dielectric back-end-of-line device fabrication. Low frequency, high density inductively coupled plasma process has been developed for the growth of Ti–Si–N film. This work employs the reaction between TixSiy and the nitrogen plasma. Ti–Si–N films have been successfully grown over different process conditions. Film properties were characterized by Rutherford backscattering spectrometry (RBS), x-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectroscopy, x-ray diffraction (XRD), and four-point resistivity probe. RBS reveals that 2–67at.% of nitrogen can be achieved through the implantation of nitrogen in TixSiy film. XPS and XRD results show that TiN and Si3N4 are successfully formed. As the external bias increases from 100to300V, there is an 80% increase in sheet resistance. Other process conditions investigated do not show a significant effect on fil...
electronics packaging technology conference | 2013
Adeline B.Y. Lim; Xin Long; Lu Shen; Xi Chen; R.V. Ramanujan; Chee Lip Gan; Zhong Chen
There is a growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on package reliability and corrosion susceptibility have driven the industry to develop alternative materials. Recently, palladium coated copper wire (Pd-Cu) wire has seen rapid entry into the market as it is believed to improve reliability of copper wire bonds on aluminum (Al) pads. However, the effect of palladium on the mechanical properties and corrosion resistance of Cu and Cu-Al intermetallics has not been studied in detail. In this paper, bulk alloys of Cu and Cu-Al with different concentrations of Pd were prepared under controlled conditions to simulate the intermetallics (IMC) formed between the copper ball bond and aluminum pads during bonding. Material properties such as elemental composition and phase formation were analyzed. Hardness and Youngs modulus of the alloys were characterized by nanoindentation. It was observed that CuAl intermetallic is the hardest and stiffest. Palladium was observed to slightly increase the modulus and hardness of the alloys.
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2012
Lu Shen; Pradita Septiwerdani; Zhong Chen
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2012
Lu Shen; Wun Chet Davy Cheong; Yong Lim Foo; Zhong Chen
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2013
Lu Shen; Zheng Yu Tan; Zhong Chen
Journal of Alloys and Compounds | 2013
Lu Shen; Pin Lu; Shijie Wang; Zhong Chen
Nuclear Instruments & Methods in Physics Research Section B-beam Interactions With Materials and Atoms | 2013
Z.A. Umar; R. S. Rawat; K.S. Tan; Aditya Kumar; R. Ahmad; Tousif Hussain; C. Kloc; Zhong Chen; Lu Shen; Z. Zhang
Thin Solid Films | 2004
Y.C. Ee; Zhong Chen; Lap Chan; Alex See; S. B. Law; Kheng Chok Tee; K.Y. Zeng; Lu Shen