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Dive into the research topics where M.E. Ali is active.

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Featured researches published by M.E. Ali.


IEEE Photonics Technology Letters | 2005

Demonstration of a compact low-power 250-Gb/s parallel-WDM optical interconnect

Brian E. Lemoff; M.E. Ali; G. Panotopoulos; E. de Groot; Graham M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; W. Gong; Richard P. Tella; B. Law; Lik-Khai Chia; D.W. Dolfi

In this letter, we demonstrate error-free operation of a 12-fiber /spl times/4-wavelength /spl times/5.21-Gb/s parallel-wavelength-division-multiplexed (PWDM) optical link. The 250-Gb/s transmitter and receiver assemblies each have a 5/spl times/8-mm footprint and consume a combined power of 1.5 W. To our knowledge, this is the first publication of a fully functional PWDM optical interconnect as well as the highest demonstrated bandwidth per unit area and bandwidth per unit power consumption for any multiple-channel fiber-optic interconnect. This technology is intended for short-distance high-bandwidth-density applications such as multiprocessor computer backplanes.


electronic components and technology conference | 2005

500-Gbps Parallel-WDM Optical Interconnect

Brian E. Lemoff; M.E. Ali; G. Panotopoulos; E. de Groot; Graham M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; W. Gong; R.P. Telia; B. Law; D.W. Dolfi

This paper describes a 500-Gbps parallel wavelength-division multiplexed (PWDM) optical interconnect where 48 channels of 10.42-Gbps data are transmitted over a parallel 12-fiber ribbon with 4 wavelengths per fiber. The transmitter and receiver are each chip-scale packages with a footprint of 5 mm times 8 mm and a combined power consumption of 3 W. This work is motivated by the continually increasing bandwidth needs of short-distance computer processor interconnects, which are demanding optical solutions that maximize bandwidth per unit area, power consumption, and cost


optical fiber communication conference | 2006

10 Gb/s transmission over 300 m OM3 fiber from 990-1080 nm with electronic dispersion compensation

Yi Sun; M.E. Ali; Kasyapa Balemarthy; Robert Lingle; Stephen E. Ralph; Brian E. Lemoff

We demonstrate numerically and experimentally the transmission of 10 Gb/s over OM3 fibers up to 300 m, under low-cost VCSEL launch conditions from 990-1080 nm with electronic dispersion compensation (EDC), showing a path to low cost 40 Gbps links.


lasers and electro optics society meeting | 2005

Parallel-WDM for multi-Tb/s optical interconnects

Brian E. Lemoff; M.E. Ali; G. Panotopoulos; E. de Groot; Graham M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; W. Gong; Richard P. Tella; B. Law; D.W. Dolfi

This article presents a promising approach for multi-Tb/s optical interconnects. This approach is contained in the MAUI project, which develops a parallel multiwavelength optical subassembly (PMOSA) that uses PWDM to gain the component-density advantages of two-dimensional parallel optics and the connector and cabling density advantages of CWDM. In the MAUI approach, a standard multimode 12-fiber ribbon is used with 4 wavelengths transmitted through each fiber, for a total of 48 optical channels.


electronic components and technology conference | 2005

Direct integration of dense parallel optical interconnects on a first level package for high-end servers

Evan G. Colgan; Bruce K. Furman; J.H. Magerlein; Jeremy D. Schaub; Clint L. Schow; D. Stigliani; J. Torok; A. Benner; D. Becker; G. Katopis; J. Abshier; W. Dyckman; Brian E. Lemoff; M.E. Ali; G. Panotopoulos; E. de Groot; Graham M. Flower; Glenn Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; William Gong; R.P. Telia; B. Law; Steven Rosenau; L.A. Buckman Windover; D.W. Dolfi

The direct integration of dense 48-channel parallel multiwavelength optical transmitter and receiver subassemblies directly onto a first level package using a flex lead attach has been demonstrated. Such an approach, at 10 Gb/s/channel would provide a linear edge bandwidth density of 300 Gb/s/cm. By attaching dense multichannel optical subassemblies directly onto an MCM, the performance limitations of the connectors and node card wiring can be avoided and the total bandwidth off the MCM can be increased while also enabling longer distance and higher speed signaling. This approach involves only a modest modification to the bent-flex approach commonly used for parallel optical modules intended for board mounting but enables a significant density and performance improvement for this application.


lasers and electro-optics society meeting | 2004

Demonstration of a high-density parallel-WDM optical interconnect

M.E. Ali; G. Panotopoulos; E. de Groot; Graham M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; W. Gong; R.P. Telia; B. Law; Lik-Khai Chia; D.W. Dolfi; Brian E. Lemoff

This work presents the first fully-functional 48-channel parallel-wavelength-division-multiplexed (PWDM) transmitter, receiver and link results at a per-channel data rate of 5.21-Gb/s. This high-density PWDM optical interconnect gives an aggregate link bandwidth of a quarter terabit per second.


optical fiber communication conference | 2005

Ultra-compact, 0.5-Tb/s parallel-WDM optical interconnect

G. Panotopoulos; M.E. Ali; E. de Groot; Graham M. Flower; G.H. Rankin; A.J. Schmit; K.D. Djordjev; Michael Tan; Ashish Tandon; W. Gong; Richard P. Tella; B. Law; D.W. Dolfi; Brian E. Lemoff

We discuss a 12-fiber /spl times/ 4-wavelength /spl times/ 10.4-Gbit/s short-distance parallel-wavelength-division-multiplexed optical interconnect. The 0.5-Tbit/s transmitter and receiver assemblies each have a 5 /spl times/ 8-mm footprint and together consume 2.95 W.


optical fiber communication conference | 2005

Novel packaging of parallel-optical interconnects for high-end servers

Steven A. Rosenau; Jonathan Simon; Lisa Buckman Windover; B. Law; Graham M. Flower; E. DeGroot; Annette Grot; M.J. Nystrom; Chao-Kun Lin; Ashish Tandon; K. Djordjev; M.R.T. Tan; Laura Wills Mirkarimi; Russell Wayne Gruhlke; Hui Xia; G. Rankin; M.E. Ali; B.E. Lemoff; Kirk S. Giboney; D.W. Dolfi; E.G. Colgan; B. Furman; J. Magerlein; J. Schaub; D. Stigliani; J. Torok; D. Becker; G. Katopis; W. Dyckman; D. O'Connor

A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio <1.5/spl times/10/sup -15/ was measured at 8 Gbit/s.


Archive | 2003

Via placement for layer transitions in flexible circuits with high density ball grid arrays

Steven A. Rosenau; M.E. Ali; Jonathan Simon; Brian E. Lemoff; Lisa A. Windover


optical fiber communication conference | 2006

10Gb/s Transmission over 300m OM3 Fiber From 990-1080nm with Electronic Dispersion Compensation

Yi Sun; M.E. Ali; Kasyapa Balemarthy; Robert Lingle; Stephen E. Ralph; Brian E. Lemoff

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B. Law

Agilent Technologies

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