M. J. Lee

Reproducible resistance switching in polycrystalline NiO films

Negative resistance behavior and reproducible resistance switching were found in polycrystalline NiO films deposited by dc magnetron reactive sputtering methods. Oxygen to argon gas ratio during deposition was critical in deciding the detailed switching characteristics of either bi-stable memory switching or mono-stable threshold switching. Both metallic nickel defects and nickel vacancies influenced the negative resistance and the switching characteristics. We obtained a distribution of low resistance values which were dependent on the compliance current of high-to-low resistance switching. At 200°C, the low-resistance state kept its initial resistance value while the high-resistance state reached 85% of its initial resistance value after 5×105s. We suggested that the negative resistance and the switching mechanism could be described by electron conduction related to metallic nickel defect states existing in deep levels and by small-polaron hole hopping conduction.

Electrical observations of filamentary conductions for the resistive memory switching in NiO films

Experimental results on the bistable resistive memory switching in submicron sized NiO memory cells are presented. By using a current-bias method, intermediate resistance states and anomalous resistance fluctuations between resistance states are observed during the resistive transition from high resistance state to low resistance state. They are interpreted to be associated with filamentary conducting paths with their formation and rupture for the memory switching origin in NiO. The experimental results are discussed on the basis of filamentary conductions in consideration of local Joule heating effect.

Improvement of resistive memory switching in NiO using IrO2

For the development of resistive memory devices using NiO, improvements of several memory switching properties are required. In NiO memory cells with noble metal electrodes, broad dispersions of memory switching parameters are generally observed with continuous memory switchings. We report the improvements in minimizing the dispersions of all memory switching parameters using thin IrO2 layers between NiO and electrodes. The role of thin IrO2 layers on NiO growth and memory switching stabilization are discussed.

Conductivity switching characteristics and reset currents in NiO films

Conductivity switching phenomena controlled by external voltages have been investigated for various NiO films deposited by dc reactive sputtering methods. Pt∕NiO∕Pt capacitor structures with top electrodes of different diameters have showed increasing off-state current with the diameter of a top electrode and nearly the same on-state current independent of the diameter. Local conductivity switching behaviors have been observed in a series structure consisting of two Pt∕NiO∕Pt capacitors with different resistance values. By reasoning out conductivity switching mechanisms from the switching characteristics and introducing multilayers consisting of NiO layers with different resistance values, we have reduced the reset current by two orders of magnitude.

Effects of metal electrodes on the resistive memory switching property of NiO thin films

The effects of various metal electrodes on the resistive switching of NiO thin films were investigated. Contrary to the belief that Pt is used for its high work function, which enables Ohmic contact to p-type NiO, resistive switching was observed in films with Ta or Al electrodes with a low work function in the as-deposited state. The resistive switching of films with a Ag or Cu top electrode with a low work function and high free energy of oxidation shows the importance of the formation of an oxide layer at the metal/NiO interface.

Different resistance switching behaviors of NiO thin films deposited on Pt and SrRuO3 electrodes

We have compared resistance switching of NiO films deposited on Pt and SrRuO3 (SRO): unipolar switching in Pt/NiO/Pt and bipolar switching in Pt/NiO/SRO. Linear fitted current-voltage curves and capacitance-voltage results show that on- and off-states conductions in unipolar switching are dominated by inductive Ohmic behavior and Poole–Frenkel effect, respectively. However, the conductions of on- and off-states in bipolar switching follow capacitive Ohmic behavior and Schottky effect, respectively. Therefore, we infer that the mechanisms of the unipolar and bipolar switching behaviors in NiO films are related with changes in bulk-limited filamentary conduction and interfacial Schottky barrier, respectively.

Oxide double-layer nanocrossbar for ultrahigh-density bipolar resistive memory.

S. H. Chang , S. B. Lee , S. M. ang , Y S. C. Chae , H. K. oo , Y Prof. W Noh . . TReCFI, Department of Physics and Astronomy Seoul National University Seoul 151-747, Korea E-mail: twnoh@snu.ac.kr D. Jeon , . Y S. J. Park , Prof. G. Kim . TSchool of Electrical Engineering Korea University, Seoul 136-701, Korea Prof. B. S. Kang Department of Applied Physics Hanyang University Ansan, Gyeonggi-do 426-791, Korea Dr. M.-J. Lee Semiconductor Device Laboratory Samsung Advanced Institute of Technology Yongin, Gyeonggi-do 446-712, Korea

Stack friendly all-oxide 3D RRAM using GaInZnO peripheral TFT realized over glass substrates

This paper reports on new concept consisting of all-oxide-based device component for future high density non-volatile data storage with stackable structure. We demonstrate a GaInZnO (GIZO) thin film transistors (TFTs) integrated with 1D (CuO/InZnO)-1R (NiO) (one diode-one resistor) structure oxide memory node element. RRAM (Resistance Random Access Memory) has provided advantages in fabrication which have made these works possible. Therefore we also suggest methods and techniques for improving the distribution in bi-stable resistance characteristics of the NiO memory node. In order to fabricate stack structures, all device fabrication steps must be possible at low temperatures. The benefits provided by low temperature processes are demonstrated by our devices fabricated over glass substrates. Our paper shows the device characteristics of each individual component as well as the characteristics of combined select transistor with 1D-1R cell. XPS analysis of NiO RRAM resistance layer deposited by ALD confirms similar conclusions to previous reports of the importance of metallic Ni content in sputtered NiO for bistable resistance switching. Also we herein propose a generalized stacked-memory structure to minimize on-chip real estate to maximize integrated density.

Electromigration effect of Ni electrodes on the resistive switching characteristics of NiO thin films

The effects of Ni and Ni0.83Pt0.17 alloy electrodes on the resistance switching of the dc-sputtered polycrystalline NiO thin films were investigated. The initial off-state resistances of the films were similar to that of Pt∕NiO∕Pt film. However, after the first cycle of switching, the off-state resistance significantly decreased in the films with Ni in the electrode. It can be attributed to the migration of Ni from electrodes to the NiO films. The improvement in data dispersion of switching parameters is explained in terms of the decrease of the effective thickness of the films resulting from the migration of Ni.

Rotation‐Misfit‐Free Heteroepitaxial Stacking and Stitching Growth of Hexagonal Transition‐Metal Dichalcogenide Monolayers by Nucleation Kinetics Controls

2D vertical stacking and lateral stitching growth of monolayer (ML) hexagonal transition-metal dichalcogenides are reported. The 2D heteroepitaxial manipulation of MoS2 and WS2 MLs is achieved by control of the 2D nucleation kinetics during the sequential vapor-phase growth. It enables the creation of hexagon-on-hexagon unit-cell stacking and hexagon-by-hexagon stitching without interlayer rotation misfits.