Makoto Ohkawa

Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate

Semiconductor device with thin film resistor having reduced film thickness sensitivity during trimming process

Etching method and method for manufacturing semiconductor device using the same

Method for fabricating semiconductor device having thin-film resistor

Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same

Method for manufacturing semiconductor device by polishing

Prodn. of semiconductor device with thin film resistance

Semiconductor device and cutting equipment for cutting semiconductor device

Cutting semiconductor device comprises forming semiconductor part in first semiconductor layer, passing laser beam on surface of first semiconductor layer, and cutting device into chip using laser beam

Etching process, especially for forming a tungsten wiring structure or barrier metal for a thin film resistor, comprises oxidizing and then removing a tungsten thin film region with an alkaline solution