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Manickam Thavarajah

LSI Corporation

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Publication

Featured researches published by Manickam Thavarajah.

Archive | 1997

Molded laminate package with integral mold gate

Qwai H. Low; Manickam Thavarajah; Chok J. Chia; Maniam Alagaratnam

Archive | 1997

Stiffener ring and heat spreader for use with flip chip packaging assemblies

Ashok Domadia; Manickam Thavarajah

Archive | 1997

Vacuum assisted underfill process and apparatus for semiconductor package fabrication

Galen Kirkpatrick; Manickam Thavarajah; Sunil A. Patel; Stephen A. Murphy

Archive | 2002

Direct positive image photo-resist transfer of substrate design

Manickam Thavarajah; Aritharan Thurairajaratnam; Alejandro Lacap

Archive | 1998

Apparatus and method for testing a flip chip integrated circuit package adhesive layer

Adrian Murphy; Manickam Thavarajah; Patrick Variot

Archive | 2003

Semiconductor package having a thermally and electrically connected heatspreader

Pradip D. Patel; Maurice O. Othieno; Manickam Thavarajah; Severino A. Legaspi

Archive | 2003

Electromagnetic interference package protection

Severino A. Legaspi; Manickam Thavarajah; Maurice O. Othieno; Pradip D. Patel

Archive | 1998

Silicon wafer or die strength test fixture using high pressure fluid

Adrian Murphy; Manickam Thavarajah

Archive | 2001

Integrated circuit package via

Aritharan Thurairajaratnam; Pradip D. Patel; Manickam Thavarajah; Hong T. Lim

Archive | 2004

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Pradip D. Patel; Maurice O. Othieno; Manickam Thavarajah; Severino A. Legaspi

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Collaboration

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Maurice O. Othieno

LSI Corporation

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Pradip D. Patel

LSI Corporation

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Severino A. Legaspi

LSI Corporation

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Aritharan Thurairajaratnam

LSI Corporation

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Adrian Murphy

LSI Corporation

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Patrick Variot

LSI Corporation

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Ashok Domadia

LSI Corporation

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Chok J. Chia

LSI Corporation

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Galen Kirkpatrick

LSI Corporation

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Hong T. Lim

LSI Corporation

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