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Patrick Variot

LSI Corporation

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Publication

Featured researches published by Patrick Variot.

Archive | 1994

Integrated circuit having a coplanar solder ball contact array

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1996

Method for encapsulating an integrated circuit package

Patrick Variot

Archive | 1995

Overmolded semiconductor package

Patrick Variot; Chok J. Chia

Archive | 1996

Apparatus for encapsulating an integrated circuit package

Patrick Variot

Archive | 1996

Surface mount peripheral leaded and ball grid array package

Chok J. Chia; Patrick Variot

Archive | 1995

Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1998

Apparatus and method for testing a flip chip integrated circuit package adhesive layer

Adrian Murphy; Manickam Thavarajah; Patrick Variot

Archive | 1997

Thin power tape ball grid array package

Chok J. Chia; Patrick Variot; Maniam Alagaratnam

Archive | 1997

Method for compensating for bottom warpage of a BGA integrated circuit

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1995

GPT system for encapsulating an integrated circuit package

Patrick Variot

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Collaboration

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Chok J. Chia

LSI Corporation

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Maniam Alagaratnam

LSI Corporation

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Qwai H. Low

LSI Corporation

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Robert T. Trabucco

LSI Corporation

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Manickam Thavarajah

LSI Corporation

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Seng-Sooi Lim

LSI Corporation

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Adrian Murphy

LSI Corporation

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Maurice O. Othieno

LSI Corporation

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Seng Sooi Lim

LSI Corporation

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Teresa Dalao

LSI Corporation

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