Marc Epitaux

Micro-machined XY stage for fiber optics module alignment

A novel silicon micro-machined XY stage with a hybrid micro-lens for fiber optics module alignment is presented. A MEMS micro-alignment method and silicon chip design are described. Finally the micro-fabricated device performance is discussed.

Automated opto-electronic packaging for 10 Gb/s transponders

Integrated transponders are quickly displacing discrete module implementation in many 10 Gb/s line card designs. The emergence of the 10 Gigabit Ethernet (10 GbE) standard had placed higher demands on manufacturing scalability to meet the volume requirements of this application. To meet these challenges, we have developed a novel automated manufacturing implementation of small form factor, high performance, and highly integrated uncooled optics. We describe the design and automated manufacturing of such modules, present their performance, and show how they enable the implementation of new miniature, low cost 10 Gb/s transponders.

Silicon optical benches for next generation optical packaging: going vertical or horizontal?

In this paper, we present an alternative silicon bench approach using a vertical stacking method to improve upon the ubiquitous TO-can design. In the proposed design, the beam propagates vertically through several layers of micro-machined silicon pieces which perform substrate, RF feedthrough, hermetic sealing and optical alignment functions. Our packaging architecture includes a MEMS (micro-electro-mechanical system) actuation layer to actively align a lens to a single mode connector. Executed at the final assembly step, this MEMS alignment alleviates the need for expensive laser welding alignment stations.

Optical Beam Steering Using a 2D MEMS Scanner

This paper presents the design, fabrication and operation principle of an optical beam steerer for laser fiber coupling based on a MEMS device. The MEMS chip consists on a bi-dimensional movable platform based on uni-dimensional comb drive actuation. An optical lens is assembled onto the mobile platform to focus and steer the light comping from a laser diode and couple it into an optical fiber. Assembly of a complete system and measurements were performed and compared to simulation results. Both the trajectory of the MEMS and resonance frewquency measurements agree with the simulated ones.

A 2D MEMS stage for optical applications

A 2D MEMS platform for a microlens scanner application is reported. The platform is fabricated on an SOI wafer with 50 μm thick device layer. Entire device is defined with a single etching step on the same layer. Through four S-shaped beams, the device is capable of producing nonlinear 2D motion from linear 1D translation of two pairs of comb actuator sets. The device has a clear aperture of 2mm by 2mm, which is hallowed from the backside for micro-optics assembly. In this paper, a numerical device model and its validation via experimental characterization results are presented. Integration of the micro-optical components with the stage is also discussed. Additionally, a new driving scheme to minimize the settling time of the device in DC operation is explored.

Beam steering system using a 2D MEMS scanner

Fiber optical modules manufacturing have been recognized as a key challenge in meeting the anticipated demand for high bandwidth telecommunication equipment. Among all challenges, submicron optical alignment for single mode fiber remains the predominant difficulty [1]. To reduce the alignment effort during the assembly, a XY micro stage has been developed. It consists of a scanning platform with a mounted micro-lens on top (Figure 1). After a passive alignment of the components and the sealing of the package, a fine tuning of the lens position and thus the optical coupling efficiency can be made by actuating the MEMS chip.

Automated opto-electronic packaging for 10 Gb/s applications

We demonstrate a new ceramic-based quasi-planar optoelectronic packaging technology specifically designed for high-speed performance and automated manufacturing. Its application to the development of miniature, low cost 10 Gb/s transponders is reviewed.

Recent Developments in Silicon-based MEMS Photonic Systems

Silicon-based photonic MEMS modulate light by displacing microoptical elements such as micromirrors and microlenses. Recent development focus on fiber-laser couplers, multi-object spectrometers, and tunable cavities.

Automated optoelectronic packaging and applications to 10 Gb/s transponders

We have demonstrated technology which provides a cost-effective solution for the volume production of future high-performance high-speed devices such as SONET and 10 Gb transponders. The optical module assembly principle is shown. The module is assembled on a ceramic substrate with a metal platform for later optical assembly. Optical chips (laser, photodiodes...) and electronic components are then mounted by pick and place techniques commonly used in the electronic industry, using fluxless soldering processes, and within an accuracy of about 10 microns. Pick and place automation using machine vision is greatly facilitated by the quasi-planar design.