Marcia Moore

30-W/mm GaN HEMTs by field plate optimization

GaN high-electron-mobility-transistors (HEMTs) on SiC were fabricated with field plates of various dimensions for optimum performance. Great enhancement in radio frequency (RF) current-voltage swings was achieved with acceptable compromise in gain, through both reduction in the trapping effect and increase in breakdown voltages. When biased at 120 V, a continuous wave output power density of 32.2 W/mm and power-added efficiency (PAE) of 54.8% at 4 GHz were obtained using devices with dimensions of 0.55/spl times/246 /spl mu/m/sup 2/ and a field-plate length of 1.1 /spl mu/m. Devices with a shorter field plate of 0.9 /spl mu/m also generated 30.6 W/mm with 49.6% PAE at 8 GHz. Such ultrahigh power densities are a dramatic improvement over the 10-12 W/mm values attained by conventional gate GaN-based HEMTs.

A 97.8% Efficient GaN HEMT Boost Converter With 300-W Output Power at 1 MHz

A 175-to-350 V hard-switched boost converter was constructed using a high-voltage GaN high-electron-mobility transistor grown on SiC substrate. The high speed and low on-resistance of the wide-band-gap device enabled extremely fast switching transients and low losses, resulting in a high conversion efficiency of 97.8% with 300-W output power at 1 MHz. The maximum efficiency was 98.0% at 214-W output power, well exceeding the state of the art of Si-based converters at similar frequencies.

Field-plated GaN HEMTs and amplifiers

Field-plates remarkably enhanced large-signal performance of GaN HEMTs by reducing trapping effect and increasing breakdown voltages. Power densities exceeding 30W/mm at 4GHz were demonstrated with gate-connected field plates. Further development of source-connected field pates boosted large-signal gain by 5-7dB, while maintaining the benefit of the field plates. Short-channel GaN HEMTs with field plates also showed promise at millimeter-wave bands. Amplifiers with 1.08-mm-wide device periphery generated 5W at 35GHz.