Marco Ferrera

Method for manufacturing integrated structures including removing a sacrificial region

Process for manufacturing components in a semiconductor material wafer with reduction in the starting wafer thickness

Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness

Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof

Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced

Integrated angular speed sensor device and production method thereof

Method of manufacturing pressure microsensors

Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom

Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby.

Method for manufacturing integrated devices including electromechanical microstructures, without residual stress