Marcus Kaestner

Nanolithography by scanning probes on calixarene molecular glass resist using mix-and-match lithography

Abstract. Going “beyond the CMOS information-processing era,” taking advantage of quantum effects occurring at sub-10-nm level, requires novel device concepts and associated fabrication technologies able to produce promising features at acceptable cost levels. Herein, the challenge affecting the lithographic technologies comprises the marriage of down-scaling the device-relevant feature size towards single-nanometer resolution with a simultaneous increase of the throughput capabilities. Mix-and-match lithographic strategies are one promising path to break through this trade-off. Proof-of-concept combining electron beam lithography (EBL) with the outstanding capabilities of closed-loop electric field current-controlled scanning probe nanolithography (SPL) is demonstrated. This combination, whereby also extreme ultraviolet lithography (EUVL) is possible instead of EBL, enables more: improved patterning resolution and reproducibility in combination with excellent overlay and placement accuracy. Furthermore, the symbiosis between EBL (EUVL) and SPL expands the process window of EBL (EUVL) beyond the state of the art, allowing SPL-based pre- and post-patterning of EBL (EUVL) written features at critical dimension levels with scanning probe microscopy-based pattern overlay alignment capability. Moreover, we are able to modify the EBL (EUVL) pattern even after the development step. The ultra-high resolution mix-and-match lithography experiments are performed on the molecular glass resist calixarene using a Gaussian e-beam lithography system operating at 10 keV and a home-developed SPL setup.

Scanning probes in nanostructure fabrication

Scanning probes have enabled modern nanoscience and are still the backbone of todays nanotechnology. Within the technological development of AFM systems, the cantilever evolved from a simple passive deflection element to a complex microelectromechanical system through integration of functional groups, such as piezoresistive detection sensors and bimaterial based actuators. Herein, the authors show actual trends and developments of miniaturization efforts of both types of cantilevers, passive and active. The results go toward the reduction of dimensions. For example, the authors have fabricated passive cantilever with a width of 4 μm, a length of 6 μm and thickness of 50–100 nm, showing one order of magnitude lower noise levels. By using active cantilevers, direct patterning on calixarene is demonstrated employing a direct, development-less phenomena triggered by tip emitted low energy (<50 eV) electrons. The scanning probes are not only applied for lithography, but also for imaging and probing of the sur...

Scanning proximal probe lithography for sub-10 nm resolution on calix[4]resorcinarene

The use of molecular resist in scanning proximal probe lithography (SPPL) offers a novel and promising maskless lithographic method with sub-10 nm resolution. Here, the authors present their investigation of the patterning capabilities of C-Methylcalix[4]resorcinarene at ambient conditions using SPPL. The STM-based setup operates in constant-current Fowler–Nordheim regime and results in positive-tone self-developing phenomena. The lithographic operation is performed at currents in the range of pico-ampere, writing speeds of 1–10 μm/s, and bias voltages ranging from 20 up to 70 V. Currently, the authors have achieved feature sizes from 7 nm to micrometers depending on the applied exposure parameters. The direct patterning process shows high reproducibility and reliability over this large feature range.

Molecular glass resists for scanning probe lithography

The presented work deals with molecular glass resist materials based on (i) calix[4]resorcinarene resist systems, (ii) twisted fully aromatic biscarbazole-biphenyl materials, and (iii) fully aromatic spiro resist materials as new promising materials for Scanning Probe Lithography (SPL). Because of the non-chemically amplified resist nature and the absence of corresponding material diffusion, the novel SPL resists have the potential to increase the patterning resolution capabilities at a simultaneous reduction of the edge roughness (LER). In addition, these low molecular weight molecular glasses offer the advantage of solvent-free film preparation by physical vapor deposition (PVD). The PVD prepared films offer a number of advantages compared to spin coated ones such as no more pinholes, defects, or residual solvent domains, which can locally affect the film properties. These high-quality PVD films are ideal candidates for the direct patterning by SPL tools. Presented highlights are the thermal scanning probe lithography (tSPL) investigations at IBM Research - Zurich and the patterning by using electric field, current controlled scanning probe lithography (EF-CC-SPL) at the Technical University of Ilmenau. Further investigations on film forming behavior, etch resistance, and etch transfer are presented. Owing to the high-resolution probe based patterning capability in combination with their improved etch selectivity compared to reference polymeric resists the presented molecular glass resists are highly promising candidates for lithography at the single nanometer digit level.

Pattern-generation and pattern-transfer for single-digit nano devices

Single-electron devices operating at room temperature require sub-5 nm quantum dots having tunnel junctions of comparable dimensions. Further development in nanoelectronics depends on the capability to generate mesoscopic structures and interfacing these with complementary metal–oxide–semiconductor devices in a single system. The authors employ a combination of two novel methods of fabricating room temperature silicon single-electron transistors (SETs), Fowler–Nordheim scanning probe lithography (F-N SPL) with active cantilevers and cryogenic reactive ion etching followed by pattern-dependent oxidation. The F-N SPL employs a low energy electron exposure of 5–10 nm thick high-resolution molecular resist (Calixarene) resulting in single nanodigit lithographic performance [Rangelow et al., Proc. SPIE 7637, 76370V (2010)]. The followed step of pattern transfer into silicon becomes very challenging because of the extremely low resist thickness, which limits the etching depth. The authors developed a computer simulation code to simulate the reactive ion etching at cryogenic temperatures (−120 °C). In this article, the authors present the alliance of all these technologies used for the manufacturing of SETs capable to operate at room temperatures.

0.1-nanometer resolution positioning stage for sub-10 nm scanning probe lithography

High Performance Single Nanometer Lithography (SNL) is an enabling technology for beyond CMOS and future nanoelectronics. To keep on with scaling down nanoelectronic components, novel instrumentation for nanometer precise placement, overlay alignment and measurement are an essential pre-requirement to realize Next Generation Lithography (NGL) systems. In particular, scanning probe based methods for surface modification and lithography are an emerging method for producing sub-10 nm features. In this study, we demonstrate nano-scale lithography using a scanning probe based method in combination with a Nanopositioning and Nanomeasuring Machine. The latter one has a measuring range of 25 mm x 25 mm x 5 mm, 0.1 nanometer resolution and outstanding nanometer accuracy. The basic concept consists of a special arrangement allowing Abbe error free measurements in all axes over the total scan range. Furthermore, the Nanopositioning and Nanomeasuring Machine is able to store the exact location that can be found again with an accuracy of less than 2.5 nanometers. This system is also predestinated for critical dimension, quality and overlay control. The integrated scanning probe lithography is based on electric-field-induced patterning of calixarene. As a result, repeated step response tests are presented in this paper.

Scanning probe lithography approach for beyond CMOS devices

As present CMOS devices approach technological and physical limits at the sub-10 nm scale, a ‘beyond CMOS’ information-processing technology is necessary for timescales beyond the semiconductor technology roadmap. This requires new approaches to logic and memory devices, and to associated lithographic processes. At the sub-5 nm scale, a technology platform based on a combination of high-resolution scanning probe lithography (SPL) and nano-imprint lithography (NIL) is regarded as a promising candidate for both resolution and high throughput production. The practical application of quantum-effect devices, such as room temperature single-electron and quantum-dot devices, then becomes feasible. This paper considers lithographic and device approaches to such a ‘single nanometer manufacturing’ technology. We consider the application of scanning probes, capable of imaging, probing of material properties and lithography at the single nanometer scale. Modified scanning probes are used to pattern molecular glass based resist materials, where the small particle size (<1 nm) and mono-disperse nature leads to more uniform and smaller lithographic pixel size. We also review the current status of single-electron and quantum dot devices capable of room-temperature operation, and discuss the requirements for these devices with regards to practical application.

2D Simulation of Fowler-Nordheim Electron Emission in Scanning Probe Lithography

2D Simulation of Fowler-Nordheim Electron Emission in Scanning Probe Lithography For the manufacturing of quantum computers it will be necessary to routinely fabricate devices with critical dimensions down to the single-digit nanometer range. Since the high-costs and belated development of extreme UV lithography, we are focused on scanning probe lithography (SPL) utilizing Fowler-Nordheim emitted electrons for patterning of molecular resist materials. Our method is similar to the electron beam lithography with special electron emitters, i.e. our nanotips, differing in the much lower energy of the emitted electrons and the possibility to work at ambient conditions. Based on the thermo-mechanically actuated, piezoresistive cantilever technology our group has developed a first prototype of a scanning probe lithography platform able to image, inspect, align and pattern features down to single nanometer regime. Here, we present theoretical investigations of the electron emission and the surface exposure with the emitted electrons. Our simulation model and the used assumptions are described. The resulting electric field and electron density distributions are analyzed to gain deeper insights into relevance of the lithographic exposure parameters.

Self-actuated, self-sensing cantilever for fast CD measurement

The conventional optical lever detection technique involves optical components and its precise mechanical alignment. An additional technical limit is the weight of the optical system, in case a top-scanner is used in high speed and high precision metrology. An alternative represents the application of self-actuated AFM cantilevers with integrated 2DEG piezoresistive deflection sensors. A significant improvement in performance of such cantilevers with respect to deflection sensitivity and temperature stability has been achieved by using an integrated Wheatstone bridge configuration. Due to employing effective cross-talk isolation and temperature drift compensation the performance of these cantilevers was significantly improved. In order to enhance the speed of AFM measurements we are presenting a fast cantilever-approach technology, Q-factor-control and novel adaptive scanning speed procedure. Examples of AFM measurements with high scanning speed (up to 200 lines/s) committed to advanced lithography process development are shown.

Tailored molecular glass resists for scanning probe lithography

In the presented work solvent-free film preparation from tailored molecular glass resists, their thermal analysis, the characterization of etch resistance for plasma etching transfer processes, and the evaluation of the patterning performance using scanning probe lithography (SPL) tools, in particular electric field and thermal based SPL, are demonstrated. Therefore a series of fully aromatic spiro-based and tris-substituted twisted resist materials were systematically investigated. The materials feature very high glass transition temperatures of up to 173 °C, which allows solvent-free thin film preparation by physical vapor deposition (PVD) due to their high thermal stability. The PVD prepared films offer distinct advantages compared to spin coated films such as no pinholes, defects, or residual solvent domains, which can locally affect the film properties. In addition, PVD prepared films do not need a post apply bake (PAB) and can be precisely prepared in the nanometer range layer thickness. An observed sufficient plasma etching resistance is promising for an efficient pattern transfer even by utilizing only 10 nm thin resist films. Their lithographic resolution potential is demonstrated by a positive and a negative tone patterning using electric field, current controlled scanning probe lithography (EF-CC-SPL) at the Technical University of Ilmenau or thermal scanning probe lithography (tSPL) investigations at the IBM Research - Zurich. High resolution tSPL prepared patterns of 11 nm half pitch and at 4 nm patterning depth are demonstrated.