Steve Lenk

Scanning probes in nanostructure fabrication

Scanning probes have enabled modern nanoscience and are still the backbone of todays nanotechnology. Within the technological development of AFM systems, the cantilever evolved from a simple passive deflection element to a complex microelectromechanical system through integration of functional groups, such as piezoresistive detection sensors and bimaterial based actuators. Herein, the authors show actual trends and developments of miniaturization efforts of both types of cantilevers, passive and active. The results go toward the reduction of dimensions. For example, the authors have fabricated passive cantilever with a width of 4 μm, a length of 6 μm and thickness of 50–100 nm, showing one order of magnitude lower noise levels. By using active cantilevers, direct patterning on calixarene is demonstrated employing a direct, development-less phenomena triggered by tip emitted low energy (<50 eV) electrons. The scanning probes are not only applied for lithography, but also for imaging and probing of the sur...

Pattern-generation and pattern-transfer for single-digit nano devices

Single-electron devices operating at room temperature require sub-5 nm quantum dots having tunnel junctions of comparable dimensions. Further development in nanoelectronics depends on the capability to generate mesoscopic structures and interfacing these with complementary metal–oxide–semiconductor devices in a single system. The authors employ a combination of two novel methods of fabricating room temperature silicon single-electron transistors (SETs), Fowler–Nordheim scanning probe lithography (F-N SPL) with active cantilevers and cryogenic reactive ion etching followed by pattern-dependent oxidation. The F-N SPL employs a low energy electron exposure of 5–10 nm thick high-resolution molecular resist (Calixarene) resulting in single nanodigit lithographic performance [Rangelow et al., Proc. SPIE 7637, 76370V (2010)]. The followed step of pattern transfer into silicon becomes very challenging because of the extremely low resist thickness, which limits the etching depth. The authors developed a computer simulation code to simulate the reactive ion etching at cryogenic temperatures (−120 °C). In this article, the authors present the alliance of all these technologies used for the manufacturing of SETs capable to operate at room temperatures.

2D Simulation of Fowler-Nordheim Electron Emission in Scanning Probe Lithography

2D Simulation of Fowler-Nordheim Electron Emission in Scanning Probe Lithography For the manufacturing of quantum computers it will be necessary to routinely fabricate devices with critical dimensions down to the single-digit nanometer range. Since the high-costs and belated development of extreme UV lithography, we are focused on scanning probe lithography (SPL) utilizing Fowler-Nordheim emitted electrons for patterning of molecular resist materials. Our method is similar to the electron beam lithography with special electron emitters, i.e. our nanotips, differing in the much lower energy of the emitted electrons and the possibility to work at ambient conditions. Based on the thermo-mechanically actuated, piezoresistive cantilever technology our group has developed a first prototype of a scanning probe lithography platform able to image, inspect, align and pattern features down to single nanometer regime. Here, we present theoretical investigations of the electron emission and the surface exposure with the emitted electrons. Our simulation model and the used assumptions are described. The resulting electric field and electron density distributions are analyzed to gain deeper insights into relevance of the lithographic exposure parameters.

Electric field scanning probe lithography on molecular glass resists using self-actuating, self-sensing cantilever

Within last two years, we have shown the positive-tone, development-less patterning of calixarene molecular glass resists using highly confined electric field, current-controlled scanning probe lithography scheme. Herein, we give a more detailed view insight describing the applied Scanning Probe Lithography (SPL) technology platform applying selfactuating, self-sensing cantilever. The experimental results are supported by first preliminary simulation results estimating the local electric field strength, the electron trajectories, and the current density distribution at the sample surface. In addition, the diameter of Fowler-Nordheim electron beam, emitted from SPL-tip, was calculated as function of the bias voltage for different current set-points and tip radii. In experimental part we show the reproducible writing of meander line patterns as well as the patterning of individual features using specially developed pattern generator software tool.

Six-axis AFM in SEM with self-sensing and self-transduced cantilever for high speed analysis and nanolithography

Merging two state-of-the-art surface research techniques, in particular, atomic force microscopy (AFM) and scanning electron microscopy (SEM), within a single system is providing novel capabilities like direct visual feedback and life-monitoring of tip-induced nanoscale interactions. In addition, the combination of AFM and SEM accelerates nanoscale characterization and metrology development. Here, the concept and first results of a novel AFM-integration into a high resolution scanning electron microscope and focused ion beam system for nanoscale characterization is presented. In this context, a six-axis AFM system using self-sensing thermomechanically transduced active cantilever was developed and integrated. The design of the developed AFM-integration is described and its performance is demonstrated. Results from combined examinations applying fast AFM-methods and SEM-image fusion, AFM-SEM combined metrology verification, and three dimensional-visualization are shown. Simultaneous operation of SEM and AF...

Large area fast-AFM scanning with active “Quattro” cantilever arrays

In this work, the fabrication and operation of an active parallel cantilever device integrating four self-sensing and self-actuating probes in an array is presented. The so called “Quattro” cantilever system is controlled by a multichannel field programmable gate array (FPGA) controller. The integrated cantilever devices are fabricated on the basis of a silicon-on-insulator wafer using surface micromachining and gas chopping plasma-etching processes [I. W. Rangelow, J. Vac. Sci. Technol., A 21, 1550 (2003)]. The unique design of the active cantilever probes provides both patterning and readout capabilities [Kaestner et al., J. Micro-Nanolithogr. MEMS 14, 031202 (2015)]. The thermomechanical actuation allows the individually operation of each cantilever in static and dynamic modes. This enables a simultaneous atomic force microscopy operation of all cantilevers in an array, while the piezoresistive read-out of the cantilever bending routinely ensures atomic resolution at a high imaging speed. The scanning ...

Advanced electric-field scanning probe lithography on molecular resist using active cantilever

The routine “on demand” fabrication of features smaller than 10 nm opens up new possibilities for the realization of many novel nanoelectronic, NEMS, optical and bio-nanotechnology-based devices. Based on the thermally actuated, piezoresistive cantilever technology we have developed a first prototype of a scanning probe lithography (SPL) platform able to image, inspect, align and pattern features down to single digit nano regime. The direct, mask-less patterning of molecular resists using active scanning probes represents a promising path circumventing the problems in today’s radiation-based lithography. Here, we present examples of practical applications of the previously published electric field based, current-controlled scanning probe lithography on molecular glass resist calixarene by using the developed tabletop SPL system. We demonstrate the application of a step-and-repeat scanning probe lithography scheme including optical as well as AFM based alignment and navigation. In addition, sequential read-write cycle patterning combining positive and negative tone lithography is shown. We are presenting patterning over larger areas (80 x 80 μm) and feature the practical applicability of the lithographic processes.

Field-emission scanning probe lithography with self-actuating and self-sensing cantilevers for devices with single digit nanometer dimensions

Cost-effective generation of single-digit nano-lithographic features could be the way by which novel nanoelectronic devices, as single electron transistors combined with sophisticated CMOS integrated circuits, can be obtained. The capabilities of Field-Emission Scanning Probe Lithography (FE-SPL) and reactive ion etching (RIE) at cryogenic temperature open up a route to overcome the fundamental size limitations in nanofabrication. FE-SPL employs Fowler-Nordheim electron emission from the tip of a scanning probe in ambient conditions. The energy of the emitted electrons (<100 eV) is close to the lithographically relevant chemical excitations of the resist, thus strongly reducing proximity effects. The use of active, i.e. self-sensing and self-actuated, cantilevers as probes for FE-SPL leads to several promising performance benefits. These include: (1) Closed-loop lithography including pre-imaging, overlay alignment, exposure, and post-imaging for feature inspection; (2) Sub-5-nm lithographic resolution with sub-nm line edge roughness; (3) High overlay alignment accuracy; (4) Relatively low costs of ownership, since no vacuum is needed, and ease-of-use. Thus, FE-SPL is a promising tool for rapid nanoscale prototyping and fabrication of high resolution nanoimprint lithography templates. To demonstrate its capabilities we applied FE-SPL and RIE to fabricate single electron transistors (SET) targeted to operate at room temperature. Electrical characterization of these SET confirmed that the smallest functional structures had a diameter of only 1.8 nanometers. Devices at single digit nano-dimensions contain only a few dopant atoms and thus, these might be used to store and process quantum information by employing the states of individual atoms.

Single nano-digit and closed-loop scanning probe lithography for manufacturing of electronic and optical nanodevices

Next-generation electronic and optical devices demand high-resolution patterning techniques and high-throughput fabrication. Thereby Field-Emission Scanning Probe Lithography (FE-SPL) is a direct writing method that provides high resolution, excellent overlay alignment accuracy and high fidelity nanopatterns. As a demonstration of the patterning technology, single-electron transistors as well as split ring electromagnetic resonators are fabricated through a combination of FE-SPL and plasma etching at cryogenic temperatures.

Experimental study of field emission from ultrasharp silicon, diamond, GaN, and tungsten tips in close proximity to the counter electrode

The patterning process in field-emission scanning probe lithography (FE-SPL), a high-resolution and cost-effective method for nanofabrication, is based on the field emission of electrons from ultrasharp tips in close proximity to a sample (distances below 100 nm). Thereby, the emitted electrons expose directly an ultrathin resist film. The field enhancement at the tip apex is crucial for the field emission current, which follows the Fowler–Nordheim theory. Despite the success of FE-SPL in nanofabrication, systematic experimental studies of the field-emission process, including the determination of the tip radius and tip-to-sample distance during the measurement, for these small tip-to-sample distances and different tip materials are lacking. To resolve this issue, experimental measurements of the field-emission current for tip–sample proximity distances below 100 nm were performed. For this purpose, the developed AFM in SEM system was modified,1,2 which enables one to monitor the tip–sample distance with a high accuracy using SEM while simultaneously recording the field-emission current. The authors present experimental results of the dependence of the field-emission current on the tip shape, tip material, applied voltage, and tip–sample distance. Therefore, the emission characteristics of silicon, diamond, GaN, and tungsten tips are shown. The knowledge about the field-emission process for small tip-to-sample distances will help to understand and improve the current FE-SPL, regarding also the choice of tip material. Furthermore, these measurements enable the detailed comparison with current FE models beyond state-of-the-art since all necessary parameters (voltage, current, tip diameter, and tip-to-sample distance) could be measured and controlled during the FE experiment due to the unique experimental system.The patterning process in field-emission scanning probe lithography (FE-SPL), a high-resolution and cost-effective method for nanofabrication, is based on the field emission of electrons from ultrasharp tips in close proximity to a sample (distances below 100 nm). Thereby, the emitted electrons expose directly an ultrathin resist film. The field enhancement at the tip apex is crucial for the field emission current, which follows the Fowler–Nordheim theory. Despite the success of FE-SPL in nanofabrication, systematic experimental studies of the field-emission process, including the determination of the tip radius and tip-to-sample distance during the measurement, for these small tip-to-sample distances and different tip materials are lacking. To resolve this issue, experimental measurements of the field-emission current for tip–sample proximity distances below 100 nm were performed. For this purpose, the developed AFM in SEM system was modified,1,2 which enables one to monitor the tip–sample distance with ...