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Dive into the research topics where Mario Francesco Cortese is active.

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Featured researches published by Mario Francesco Cortese.


Archive | 2009

Sensors and Actuators on CMOS Platforms

Christoph Hagleitner; Michel Despont; Peter Vettiger; Mario Francesco Cortese; Benedetto Vigna

The monolithic or hybrid integration of sensors and actuators (S&A) onto CMOS platforms is of great importance to reduce the device size and cost as well as to facilitate new functionalities and better performance. Hence, S&As on CMOS platforms are important and convincing examples of “more than Moore.” This chapter focuses on a broad range of aspects of S&As on CMOS platforms. First, the basic concept is introduced, followed by a detailed description of the fundamentals of current S&A concepts. The current market situation is then described, demonstrating the great opportunities for S&As. A substantial part of the chapter is devoted to the various techniques and fabrication processes for monolithic and hybrid integration of S&As on CMOS. Successful examples of very large-scale integration (VLSI) ofS&As on CMOS platforms are also described. Current research into the use nanostructures for new or better S&A functionalities or improved performance is described in an additional subsection. Finally, the equally important back-end-of-the-line aspects in large-volume production, packaging, and testing are presented. The chapter closes with the authors’ outlook and view on the challenges and opportunities in research, development, production, and marketing of new and better S&As, VLSI-type S&As on single-chip CMOS platforms, and S&A networks.


Archive | 2010

Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

Sebastiano Conti; Benedetto Vigna; Mario Francesco Cortese


Archive | 2012

Microelectromechanical transducer and corresponding assembly process

Kevin Formosa; Mark Anthony Azzopardi; Mario Francesco Cortese; Mark Andrew Shaw; Alex Gritti; Luca Maggi; Filippo David


Archive | 2009

ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES

Lorenzo Baldo; Chantal Combi; Mario Francesco Cortese


Archive | 2008

Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type

Mario Francesco Cortese; Mark Anthony Azzopardi; Edward Myers; Chantal Combi; Lorenzo Baldo


Archive | 2008

ELECTRONIC DEVICE COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES

Lorenzo Baldo; Chantal Combi; Mario Francesco Cortese


Archive | 2009

PLANAR MICROELECTROMECHANICAL DEVICE HAVING A STOPPER STRUCTURE FOR OUT-OF-PLANE MOVEMENTS

Angelo Merassi; Mario Francesco Cortese; Viola Fulvio; Barbara Simoni; Andrea Rusconi Clerici Beltrami


Archive | 2009

Lid, fabricating method thereof, and mems package made thereby

Mario Francesco Cortese; Mark Anthony Azzopardi; Shih-Ping Hsu; Kun-Chen Tsai; Ivan Micallef


Archive | 2006

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES

Federico Giovanni Ziglioli; Giovanni Graziosi; Mario Francesco Cortese


Archive | 2013

Packaged sensor structure having sensor opening and package opening aligned with sensor element

Lorenzo Baldo; Chantal Combi; Mario Francesco Cortese

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